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JUKI High Speed chip placer FX-3RA Mounter 120000CPH China agent Applicable Components: 0402~5050 Board size:50×50??650×370? Feeder inputs:max.112 placement capacity:40,000 CPH Product description: JUKI High Speed chip placer FX-3R
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Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
Industry News | 2014-02-21 12:50:41.0
Kyzen today announced that Mike Bixenman, DBA, CTO, and David Lober will present at five separate technical sessions at IPC APEX EXPO in Las Vegas in March.
Industry News | 2011-01-22 00:27:29.0
Design, assembly, soldering, repair, rework, inspection, and materials choice are all variables to be juggled as electronics manufacturers worldwide work with new component types, high speed signals and lead-free technology. To assist them in making the best choices for producing reliable electronics, IPC — Association Connecting Electronics Industries® is holding the IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest, Hungary, on 22–24 February 2011.
Technical Library | 2019-06-04 10:19:46.0
Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance.
Technical Library | 2020-03-01 23:06:45.0
For though hole soldering, no matter it's wave soldering or selective soldering, the process is same formed by fluxing,preheating,soldering. How these 3 process will change the soldering result? When you face the soldering defects, what could be the reasons caused these and how to debug them? With below information you may get some hints.
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