We repair thousands of instruments that are no longer supported by the original manufacturer. We have an extensive parts inventory assuring prompt turnaround times and competitive prices. Test Equipment Connection offers full service N.I.S.T. trace
New Equipment | Industrial Automation
Contact :Sandy Lin Email: unity@mvme.cn Mob/Whatsapp :+ 86 18020776786 Tel : +86 592 5165503 Skype: onlywnn_1 Wechat : mooreplc website : www.salesplc.com PRODUCT PARAMETERS 1.Shipping will be made via DHL(Worldw
Electronics Forum | Tue May 12 10:03:12 EDT 2009 | daan_terstegge
Hi All, I see more and more components like QFN or LGA with bottom-only terminations,with landpatterns getting finer all the time. I have no ppm-figures of our process, but based on a benchmark study by Agilent I'd say that 500 ppm is a decent value
Electronics Forum | Tue Nov 01 14:46:31 EDT 2011 | davef
Agilent TestJet Technology White Paper In the early 1990s, the testing of digital parts became problematical. Previous in-circuit test techniques sought to ensure a correct, functioning part by applying digital patterns, called vectors, to the input
Used SMT Equipment | In-Circuit Testers
Agilent ControlPlus, Hybrid 6 & 12 SD Pin Cards, Analog Plus DD cards. Great Pricing. Call for details today.
Used SMT Equipment | AOI / Automated Optical Inspection
we have Agilent SJ10 and SP50 for sales customerst@163.com
Industry News | 2003-04-03 08:51:07.0
Symphony 3070TM Package from JTAG Technologies for Testing and In-System Flash / PLD Programming
Industry News | 2015-05-11 08:51:25.0
SMT provider located in San Nicola la, Caserta, Italy will be liquidating their assets utilizing the online auction services of Baja Bid, Troostwijk and Heritage Global.
Parts & Supplies | General Purpose Test & Measurement
54754A Main features Superior testing with noise signature RMS: 0.25 mV (12.4 GHz bandwidth) or 0.5 mV (18 GHz bandwidth) and ±2 VDC maximum input signal Two built-in step generators can be configured for 1-port common-mode, 2-port common mode,
Technical Library | 2012-10-18 21:58:51.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish.
Events Calendar | Wed Jul 12 00:00:00 EDT 2023 - Wed Jul 12 00:00:00 EDT 2023 | ,
Penang Chapter Webinar: 6G Manufacturing Challenges and Opportunities
