Electronics Forum: agilent and w1314a-113 (Page 1 of 1)

QFN's and LGA's

Electronics Forum | Tue May 12 10:03:12 EDT 2009 | daan_terstegge

Hi All, I see more and more components like QFN or LGA with bottom-only terminations,with landpatterns getting finer all the time. I have no ppm-figures of our process, but based on a benchmark study by Agilent I'd say that 500 ppm is a decent value

ICT and specifying PCBA testing

Electronics Forum | Tue Nov 01 14:46:31 EDT 2011 | davef

Agilent TestJet Technology White Paper In the early 1990s, the testing of digital parts became problematical. Previous in-circuit test techniques sought to ensure a correct, functioning part by applying digital patterns, called vectors, to the input

Dima's Pick and Place Machines and other low volume P&P

Electronics Forum | Fri Apr 27 12:38:40 EDT 2007 | Cal

Basem, I worked directly with both Essemtec and Dima and if you send me an email I can help provide direction. cal_Driscoll@hotmail.com Unfortunately,I have been out of the SMT world for almost 4 years now. I would lean more towrds the Essemtec as

New Pick and Place Operation

Electronics Forum | Tue Jan 17 12:25:56 EST 2006 | Cmiller

Pete C, this forum has no value if people do not share thier real world experience. We can all do research on our own. We can all make bad decisions or good decisions based on that research because most of the data we have access to comes from the pe

ICT and specifying PCBA testing

Electronics Forum | Mon Mar 29 12:10:14 EDT 2010 | rway

Test Jet will work for catching lifted leads, certainly. X-ray is the only thing for testing for internal solder defects such as voids and cracks. I personally do not have any experience using X-ray, so I cannot advise on its reliability. Perhaps

MVT GS-1 Service, Training and Support

Electronics Forum | Thu Mar 04 11:27:05 EST 2004 | Alan

Did you try contacting Agilent or their support partners (CSA) ?? I know for a fact they still have a couple of guys there that are still familiar with the Console setup of the GS-1's.

Touch-up and inspection of visual defects

Electronics Forum | Mon Apr 25 11:24:31 EDT 2005 | Daan Terstegge

I have a question about inspection, touch-up, and how far you need to go to get a product that meets the required IPC-spec. According to some reports (i.e. "New Study Reveals Component Defect Levels" by Stig Oresjo of Agilent) the average defect leve

Supply Chain Agility and Better Communication-Survey

Electronics Forum | Tue Sep 21 21:15:43 EDT 2010 | terrybaker001

Please help, I humbly ask for your opinions on SMT manufacturing supply chains, and I hope to provide you with valuable information to remain competitive in a volatile market. Hello, my name is Terry Baker, I am a doctoral candidate looking for par

AMR Technology: Revolutionizing Efficiency and Flexibility

Electronics Forum | Wed Aug 09 19:14:41 EDT 2023 | solderingpro

In today's fast-paced manufacturing landscape, Surface Mount Technology (SMT) factories are seeking ways to enhance efficiency and flexibility while maintaining high-quality standards. The evolution of Autonomous Mobile Robots (AMRs) has provided an

Supply Chain Management for the competitive and Agile company

Electronics Forum | Sun Sep 12 17:56:19 EDT 2010 | terrybaker001

Hello to all interested parties, I am a doctoral candidate looking for participants in a survey about supply chain efficiency based on communication. Particularly I am interested in people in the PCBA (Printed Circuit Board assembly) industry in manu

  1  

agilent and w1314a-113 searches for Companies, Equipment, Machines, Suppliers & Information

Selective soldering solutions with Jade soldering machine

Component Placement 101 Training Course
Pillarhouse USA for Selective Soldering Needs

Reflow Soldering 101 Training Course
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

World's Best Reflow Oven Customizable for Unique Applications