Shanghai Kingtest Technologies was founded in 2003 as a fixture house and ATE service company . We specialize in Agilent3070 and Teradyne ATE system,Software development&fixture. Buy and sell usedAgilent3070/Teradyne/Genrad/ ATE Test Systems. We have Agilent/HP3070 ,Teradyne Z1888-2 ICT in stock available for rental service. Including all parts replacement warranty during rent term
Acculogic introduces StatManager™ - an advanced test program coverage report generator with boundary scan fault inject capability. StatManager can calculate part and pin level coverage of Teradyne Spectrum and Teradyne Z18xx test programs. StatMana
Electronics Forum | Mon Aug 08 17:14:42 EDT 2005 | Cmiller
Is there anybody out there who has a current support contract with Agilent that can download the patch to bring version 3.81a to 3.81b off thier website? They never sent it to us, they did end us version 5 a few years ago but dont want to upgrade to
Industry News | 2014-08-04 14:21:02.0
EMS provider Kimball Electronics in Tampa, Florida will be liquidating some of their excess and unused assets utilizing the online auction services of Baja Bid. The bidding for the “SEALED BID” auction will be closing promptly at 5pm EST on this Thursday (August 7, 2014).
Technical Library | 2010-05-20 17:17:03.0
As several industry pundits have expressed in recent years: "the era of 'one test method fits all' seems well behind us." For most test managers with even a modest mix of products, trying to formulate a test policy/philosophy has become a tricky balancing act at the best of times. James Stanbridge, Sales Manager UK for JTAG Technologies, and Steve Lees Managing Director of ATE Solutions look at the options.
Technical Library | 2013-02-14 12:54:29.0
Boundary-scan (1149.1) technology was originally developed to provide a far easier method to perform digital DC testing to detect intra-IC interconnect assembly faults, such as solder shorts and opens. Today's advanced IC technology now includes high-speed differential interfaces that include AC or DC coupling components loaded on the printed circuit assembly. Simple stuck-at-high/low test methods are not sufficient to detect all assembly fault conditions, which includes shorts, opens and missing components. Improved diagnostics requires detailed circuit analysis, predictive assembly fault simulation and more complex testing to isolate and accurately detect all possible assembly faults... First published in the 2012 IPC APEX EXPO technical conference proceedings
Career Center | Appleton, Wisconsin USA | Engineering,Production,Research and Development,Technical Support
I have more than 25 years of experience in electronics manufacturing and printed circuit board (PCB) structural test. My forte is in-circuit test (ICT) program and fixture development and debug on the HP/Agilent 3070. I have more than 16 years of 3