AGS was established based upon the concept that a fully refurbished piece of equipment should look, function and provide the same operational output as when it was purchased new.
New Equipment | Solder Materials
WE HAVE BGA SOLDER BALLS, SOLDER SPHERES. Sizes from 0.20mm and up. Quantities from one to one million or more. Available in Lead & Lead Free Solder. One price for Lead, (Sn63Pb37) or Lead Free, (Sn96.5Ag3Cu0.5) in any of these listed solder ball
New Equipment | Solder Materials
I.C.T | Antioxidant Silver Soldering Tin Lead Free Solder Bar for Solder Wave ❙ Introduction I.C.T has been working with suppliers to develop environmentally friendly lead-free solders and related materials and can now supply products that delive
Electronics Forum | Wed Aug 23 16:46:52 EDT 2000 | Dr. Ning-Cheng Lee
Comparing 62Sn/36Pb/2Ag with 63Sn/37Pb, addition of 2% Ag introduces two major advantages. The first advantage is grain refining, and the resultant better fatigue resistance. The second advantage is a wider processing window on Ag metallization. Pres
Electronics Forum | Wed Mar 23 12:45:24 EST 2005 | jdumont
Any reason why you would switch to Immersion Ag from ENIG? I am also considering the use of Immersion Ag (switching from good ol 63/37). Are there any papers on the benifits/problems of ENIG vs Immersion Ag?? Thanks in advance JD
Used SMT Equipment | Screen Printers
Make: Mycronic Model: My600 Jet Printer Vintage: 8/2016 Details: • Internal Conveyor • 2D Camera • Internal Injector Cooling Unit • Barcode Scanner USB • Network Interface • SMEMA Compliant • 2D Inspection & Repair • Offline PC with MYCAM
Industry News | 2003-01-24 08:42:19.0
The Take-over Will Become Effective Feb. 1, 2003
Industry News | 2003-06-20 08:18:46.0
Providing the ideal solution to high-current PCB applications where height restrictions are a major consideration is Finder's 40.11 series flatpack PCB relay.
Parts & Supplies | SMT Equipment
Siemens AG PCB illuminat camera lighting Part Number : 00316823-03 Siemens Nozzles Available 00321862-05 Siemens 715 915 Nozzle 00321863-07 Siemens 717 917 Nozzle 00321864-05 Siemens 718 918 Nozzle 00321867-05 Siemens 719 919 Nozzle 0032259
Parts & Supplies | Pick and Place/Feeders
1 SX 10862GH810AA 2 SA 10807GH811AG 3 S 10807GH812AG 4 M 10807GH813AF 5 ML 10807GH814AF 6 MG 10807GC007 7 MG-P 10807GC008AA 8 LA 10807GH815AF
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2007-02-01 09:27:47.0
The purpose of the testing was to compare the resistance and check for open circuit conditions of reworked BGA test samples made with and without StencilQuik™ after 500 thermal shock cycles. StencilQuick™ is a product of Best Inc. In this series of tests, the resistance of daisy chain resistance patterns running between the BGA and test board after exposure to thermal shock was measured.
E1330717000 ZST SHUTTER GUIDE E1330721000 COVER FUR E133072100A COVER FUR (ST) E133072100B COVER FUR (ZN) E1330725000 COVER FUR E13307250B0 COVER (UPPER) SUB ASM. E1330725FA0 COVER (UPPER) ASM.(STB) E1331706000 FEEDING CAM PLATE E1331
This conveyor allows for contact with the engineer, for transportation to a work table for inspection. • SMEMA Interface • Durable structure with double base plate • Buzzer • Body: 810mm; Gateway: 600mm • Sliding with st
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Webinar: The IPC Digital Twin Standard
Events Calendar | Wed Jun 05 00:00:00 EDT 2019 - Thu Jun 06 00:00:00 EDT 2019 | Neustadt a.d. Donau, Germany
TechDays 2019
Career Center | Pitman, New Jersey USA | Engineering
Open Position: Field Service Engineer Company: Essemtec USA Location: Should be midwest, southeast, or west coast Job Description: Your tasks will include: • Installation, maintenance and repair of our equipment at customer site •
Career Center | Glassboro, New Jersey USA | Engineering
Essemtec USA has an immediate opening for a field service engineer to help us with: On Site Customer Support Perform installation, preventative maintenance and repair on Essemtec equipment Set up equipment specific processes at customer sites Pre
Career Center | noida, India | Maintenance,Production,Technical Support
Over 16 years of experience in Assembly Line Production, PCB, SMT, Process Improvements, testing & troubleshooting, time and motion study, Value– Engineering as well as Quality in varied industries
Career Center | noida, India | Maintenance,Production,Technical Support
Over 16 years of experience in Assembly Line Production, PCB, SMT, Process Improvements, testing & troubleshooting, time and motion study, Value– Engineering as well as Quality in varied industries
Technology (IMPACT) Lab Silver nanowires (Ag NWs) possess
widely adopted Sn-3.0Ag-0.5Cu solder alloys for
