Technical Library: alan (Page 1 of 1)

Conductive Adhesive Dispensing, Process Considerations

Technical Library | 1999-08-27 09:24:56.0

Dispensing conductive adhesives in an automated factory environment creates some special challenges. A robust production process starts with understanding the adhesives in their fluid state and which important parameters must be controlled. Developing this understanding requires experience with a large number of materials and valves over time. Common uses of conductive adhesives in surface mount applications, die attach applications, and gasketing are addressed. As vendors of dispensing equipment, the authors see a constant stream of such applications. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality and speed are given.

ASYMTEK Products | Nordson Electronics Solutions

Choosing An Oscilloscope

Technical Library | 2016-10-07 12:50:02.0

15 points to consider when about to purchase a new oscilloscope

Saelig Co. Inc.

Dross and the Selective Soldering Process

Technical Library | 2011-02-24 19:20:14.0

In the selective soldering process, dross can be detrimental. Dross (and I use this term to encompass all surface contamination) is created in conjunction with the presence of Oxygen in two different areas of the process, and by separate means. Each must

SELECT Products | Nordson Electronics Solutions

The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array

Technical Library | 2012-06-21 23:06:06.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Most high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products despite the increasing trend for design and conversion

Alcatel-Lucent

Issues and Challenges of Testing Modern Low Voltage Devices with Conventional In-Circuit Testers

Technical Library | 2012-12-14 14:25:37.0

The popularity of low voltage technologies has grown significantly over the last decade as semiconductor device manufacturers have moved to satisfy market demands for more powerful products, smaller packaging, and longer battery life. By shrinking the size of the features they etch into semiconductor dice, IC manufacturers achieve lower costs, while improving speed and building in more functionality. However, this move toward smaller features has lead to lower breakdown voltages and increased opportunities for component overstress and false failures during in-circuit test.

Teradyne

AOI Capabilities Study with 03015 Component

Technical Library | 2019-01-23 21:33:32.0

Automated Optical Inspection (AOI) is advantageous in that it enables defects to be detected early in the manufacturing process, reducing the Cost of Repair as the AOI systems identify the specific components that are failing removing the need for any additional test troubleshooting1-3. Because of this, more Electronic Contract Manufacturing Services (EMS) companies are implementing AOI into their SMT lines to minimize repair costs and maintain good process and product quality, especially for new component types. This project focuses on the testing of component package 03015 which is challenging for AOI.

Flex (Flextronics International)

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