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Electronics Forum | Wed Jan 09 13:39:48 EST 2008 | ck_the_flip
Mask finish is the #1 variable for micro-balling with wave and selective processes. The #2 variable is the Flux. There are some flux formulations out there who're known to have additives that virtually eliminate micro-balling. However, keep in min
Industry News | 2008-05-30 14:53:00.0
NASHVILLE � May 30, 2008 � Kyzen Corporation, a world leading provider of environmentally responsible precision cleaning products for the electronics and high-technology manufacturing operations, announces that it will display AQUANOX A4625 Aqueous Cleaner for Lead-Free Flux Residues and METALNOX M6440 aqueous immersion cleaner and brightener in booth 3030 at the Medical Design & Manufacturing (MD&M) East 2008 exhibition and conference, scheduled to take place June 3-5, 2008 at the Jacob K. Javits Convention Center in New York.
Industry News | 2009-10-09 23:00:07.0
NASHVILLE — September 2009 — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it will feature MICRONOX® MX2302 wafer-level cleaning solution in booth 1022 at the upcoming IMAPS 42nd International Symposium on Microelectronics, scheduled to take place November 3-5, 2009 at the San Jose Convention Center in San Jose, CA.
Detailed Product Description Brand: Samsung Part Name: Power Supply Model: STW400-24 Machine Model: SM482 Condition: Original Used Location: Shenzhen STW400-24 Power Supply For Samsung SM482 Surface Machine Original Used Description: 1, Bra
Detailed Product Description Brand: Panasonic Model: MSMA152A1C Name: AC Servo Motor Input: 200V Current: 9.4A Output: 1.5KW 1500W AC Servo Motor MSMA152A1C For Samsung CP45 Surface Mount Machine Detail Information: 1, Part Name: AC Servo M
Technical Library | 2009-07-01 09:24:25.0
During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new methodology has been recently developed to further increase the propensity for successful cleaning.ii At the core of this method is the thermal identification of the residue matrix. Thermal energy changes the physical state, i.e. transitions between liquid, solid and gas phases. By taking advantage of such specific information during phase transitions, the cleaning process can be tailored to such settings, which in turn increases the cleaning success significantly.
Technical Library | 2015-12-23 16:57:27.0
The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects, the causes of copper barrel cracks in printed circuit board (PCB) plated through holes is not well understood. Accordingly, there is a need to determine what affects the onset of barrel cracks and then control those causes to mitigate their initiation.The objective of this research is to conduct a design of experiment (DOE) to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks. The test vehicle used will be a 16-layer epoxy-based PCB that has two different sized plated through holes as well as buried vias.
Career Center | Calamba City, Laguna Philippines | Engineering
Electronic Manufacturing Services (EMS) – SMT-EOL Process Engineer (August 2005 – Present) • Responsible for feasibility study for existing product and new product and conceptualize product assembly or process flow taking into consideration the manu