Electronics Forum | Mon Dec 11 12:46:02 EST 2000 | Christopher Lampron
We too had a problem with the WS609. We have since switched to Alpha's WS619 (same formula with an anti-foaming agent) This really helped but we still monitor flux application and try to minimize wherever possible. Chris
Electronics Forum | Tue Jun 11 14:58:45 EDT 2002 | Chris Lampron
Hello Sean, We are currently using a Pin in Paste process to mount some through hole relays. This particular board has 72 relays per. We have cut the stencil to overprint the hole. By putting a small amount of solder in the hole to flux the lead, th
40731 | https://www.smta.org/harsh/Harsh-Environments-Conference-Program-2020.pdf
Surface Mount Technology Association (SMTA)
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
(Figure 9). The solder paste was Alpha tin/lead solder alloy WS- 609. The components were placed using the Universal Advantis machine. Figure 9. MPM Stencil Printer The test vehicle was reflowed in a Heller 1912EXL Convection Reflow Oven. This oven had 14