Industry Directory | Manufacturer
A Manufacturer of High Quality, Precision, Automated Fluid Dispensing and Conformal Coating Systems, SMT Cover Tape Peel Tester and Lead Forming machines for through-hole component preparation.
Industry Directory | Consultant / Service Provider / Manufacturer
Electronic manufacturing services - electronic design, development and manufacturing. Circuit board design, prototyping, FPGA services, signal integrity and simulation, pcb assembly. Factories in California USA and Malaysia.
New Equipment | Curing Equipment
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Form & Cut 2-, 3-, 4-, 5-, and 7-leaded Radial Components Capable of forming loose radial components at rates up to 5,000 parts per hour with a variable speed motor. Feed components by hand or with tubes (TO-220s) Reduce setup time with quick ch
Electronics Forum | Thu Jul 14 01:08:30 EDT 2005 | pyramus
I too experience it too component being blown out of the pad also using heller 1800. In my case I also did check entry and exit of reflow so far no obtruction. Also checked profile setting also ok. Mine is a 0603 Chip capacitor... but problem is o
Electronics Forum | Thu Apr 28 07:24:08 EDT 2005 | SMT Production
and also check BTU blower because heat can also damage your component
Used SMT Equipment | Pick and Place/Feeders
This Juki KE2060L Pick & Place machine is available for immediate purchase. This machine also includes: [1] Trolley [30] 8mm feeders [4] 12mm feeders [4] 16mm feeders [1] 24mm feeder Please contact ashlin@bajabid.com with any interest.
Used SMT Equipment | Pick and Place/Feeders
Assembleon Opal X II SMT Pick & Place Type: PA131404 NC: 946601314041 This lot also includes: (20) 8mm OPAL FEEDERS Serial: FFPB709Y10257 Features: 8-Head Hours: 19452 200-416V 3 Phase AC 50/60Hz 4.4KVA CE Marked Note: Machine uses mechan
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2023-06-12 21:13:08.0
HELLER joined the 97th CEIA China Electronics Intelligent Manufacturing Summit Forum convened in Wuhan, garnering substantial attention from industry insiders. The conference concentrated on a wide array of fields, including optoelectronic communication, military electronics, and EV automotive electronics. With an impressive turnout of nearly 500 industry colleagues, the event proved to be an invaluable platform for networking and knowledge exchange.
Parts & Supplies | Pick and Place/Feeders
We can supply FUJI NXT/NXT II/NXT III/XPF/AIMEX feeders: 4MM W04b / W04f 8MM W08 / W08b / W08c / W08f / W08n 12MM W12 / W12c 16MM W16 / W16c 24MM W24 / W24c 32MM W32 / W32c 44MM W44 /
Parts & Supplies | Pick and Place/Feeders
12MM W12 / W12c 16MM W16 / W16c 24MM W24 / W24c 32MM W32 / W32c 44MM W44 / W44c 56MM W56 / W56c 72MM W72 88MM W88 Also Single Stick Feeders Vibratory Stick Feeders Ro
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
http://www.gpd-global.com Conformal coating (SimpleCoat) demonstration of the Spray Valve and Volumetric Pump in action on the SimpleCoat system. The Spray Valve sprays HumiSeal 1B31 from a height of approximately 20 mm above the board. The Volumetr
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | ON DEMAND | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Sep 23 00:00:00 EDT 2019 - Wed Sep 25 00:00:00 EDT 2019 | Millis, Massachusetts USA
SMTAI Rosemont
Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,
Silicon Valley Chapter Webinar: Electronics Reliability for Autonomous Vehicles
Career Center | , Texas USA | Production,Purchasing
Tier 2 EMS restructured and poised to grow. Seeking Materials Manager to lead a 250,000 sq ft site's materials. Reports to VP Global SCM. PCBA and Capital Equipment assembly. $110-120k plus bonuses. Also need a Business Dev. Mgr. Also Material
Career Center | Dallas, Texas USA | Engineering
Requirements: 3 plus years experience using RF Test Equipment {ATE} Testing frequencies ranging from 900 mhz-3 ghz, prefer experience to 6 ghz instrumentation. "Blue Tooth" cellular phones are the products being tested. Must be able to write test pro
Career Center | , Illinois USA | Engineering,Management
Almost 20 years of PCBA process engineering and project management.
Career Center | Valencia, California | Clerical,Production,Quality Control
I worked for AMS Fulfillment for 13 years, working in differents departments doing pick & pack, scanner, Data entry of WAMS, In Process, Credit Memos, Inventory transactions,QC, Labeling, Production, team assembler, also as General worker applying f
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