Industry Directory | Distributor
Your alternate source of electronic components inventory
Industry Directory | Manufacturer
Qualitetch utilse photo etching, wire EDM, laser cutting, metal forming, machining to offer the "Total Metal Component Solution" to customers requiring thin gauge metal components in most metals.
New Equipment | Coating Equipment
Cost-effective Solutions for Conformal Coating New cost-effective, automated Conformal Coating System (SimpleCoat TR) with tilt and rotate capability and excellent repeatability for just under $48,000. SimpleCoat basic model without tilt and rotate
Features of Refurbished JUKI JX-350 High Efficiency SMT Placement Machine Chip: 32,000CPH chip (Laser centering/Optimum); 21,000CPH chip (Laser centering / IPC9850). ■ From 0603 to 33.5mmsquare components. ■ JUKI laser centering for high speed,
Electronics Forum | Wed Jul 12 03:53:23 EDT 2006 | dougs
Hi Rob, I've decided at the moment to put them all over the wave, i'll keep looking into getting alternatives that are designed to be suitable and later on will hopefully switch some parts over. many thanks again Dougs
Electronics Forum | Mon Apr 17 16:17:47 EDT 2000 | Dennis Fall
Typically, Sn/Pb solders are used to preserve solderability on leaded and leadless SMT components. Are other finishes (such as those used in PCB manufacturing e.g. Sn, NiAu, OSP's, etc.) frowned upon by PCB stuffers and their customers? I am intere
Used SMT Equipment | Pick and Place/Feeders
Device parameters Paste head: 2 Paste heads(simultaneously adsorbed alternately) Mounting accuracy: ± 0.03 mm/chip(when laser recognition) ± 0.09 mm / QFP(when laser recognition) Paste speed: 0.32 seconds / CHIP, 1.8 seconds QFP) B
Used SMT Equipment | Pick and Place/Feeders
Concept: Over drive motion Ultimate access Super wide range DDH V5 Smart operation Voluntary line operation Wide open &Easy access Quick exchange Auto changeover PP type LISA Feeder hot swap Chip theory speed 84500chip Placement ra
Industry News | 2013-10-10 09:56:45.0
GPD Global has again pushed the limits for small-volume dispensing with its new Nano-Piston pump. Dots of conductive adhesive down to 100 μm and solder paste for 01005s are possible with the Nano-Piston Pump.
Industry News | 2016-07-16 13:32:29.0
Advanced dispense technology is available for integration into your dispensing system. Continuously Volumetric, drip-and-drool free dispense technology can now be retrofitted into your dispense robot. GPD Global's Volumetric PCD pumps ensure the success of applications like underfill, LED encapsulation, solder mask, silicones, conductive ink, conformal coatings, and more. Improve your throughput and yields by retrofitting a Volumetric PCD Pump into your dispense system to simplify the dispense process.
Parts & Supplies | Chipshooters / Chip Mounters
Yamaha Assembleon FCM ASSEMBLEON FCM MELF Part Number:5322 479 60114 Assembleon FCM TiN Coated Nozzle for Melf components. Alternative Part #'s PA2747/50. ASSEMBLEON FCM LARGE Part Number:9466 027 47301 Assembleon FCM TiN Coated Nozzle Large with 1
Parts & Supplies | Chipshooters / Chip Mounters
39a nozzle yamaha ASSEMBLEON - YAMAHA TYPE 35 MELF (R-0.75) Part Number:A35MF-075R 32-1 WITH REFLECTOR Part Number:5322 360 10199 Alternative Part #'s KMO-M711B-DIF-NA. 32 Part Number:9466 029 62721 31 WITH SPRING Part Number:KMO-M711A-02XSP 39
Technical Library | 2020-02-26 23:24:02.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-inpackage (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Technical Library | 2021-06-15 15:17:33.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-in-package (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
In-line or stand-alone fluxer/pre-heater This compact modular in-line system utilises the same design concept as the new generation Synchrodex soldering cell and offers the user significantly reduced process time when compared to using a single sold
A Sustainable Alternative - Humitector™ Type 2 cards are halogen-free and cobalt dichloride free. For more information on Type 2 Humidity Indicators, visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Training Courses | | | IPC-7711/7721 Specialist (CIS) Recert.
The Certified IPC-7711/7721 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-7711/7721 Specialist.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Thu Mar 26 00:00:00 EDT 2020 - Thu Mar 26 00:00:00 EDT 2020 | ,
Automotive Electronics Webinar
Career Center | Brooklyn, New York USA | Engineering
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Career Center | Rockledge, Florida USA | Purchasing
Primarily responsible for overseeing the purchasing of materials required for production of PCB assemblies. Individual will establish new and alternative supply sources, and negotiate prices and delivery schedules. Individual will communicate with mu
Career Center | , Minnesota USA | Engineering,Management,Production,Quality Control,Technical Support
Engineer with a diverse background in management, quality, computer and customer service. Experience includes optics, electrical, mechanical, physics, chemistry, process and systems engineering, implementing computers and computer applications for m
Career Center | , Minnesota | Engineering,Management,Production,Quality Control,Technical Support
Engineer with a diverse background in management, quality, computer and customer service. Experience includes optics, electrical, mechanical, physics, chemistry, process and systems engineering, implementing computers and computer applications for m
| https://unisoft-cim.com/view-markup_quoting_assembly-cost-estimation-report-for-quoting.html
Assembly Cost by Component Span Report for Quoting | Unisoft Manufacturing Software | Unisoft ≡ Menu Skip navigation For over 35 years, Intelligent PCB Manufacturing Automation Software Be production ready in minutes, not days
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_library-expert-2015-19-released_topic1794.xml
. Alternate name was kept the same.Added a second Component Name to parts for the Assembly LayerFixed a problem that was causing the hole for slotted pads not to import properly3D
