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PCBNPI is a printed circuit board (PCB) manufacturer who is mainly specialized in full-feature PCB production,including quick-turn prototyped PCB,small-batch PCB production and mass PCB production,covering almost all kinds of PCBs including FR4,
Electronics Forum | Sun Sep 22 13:14:56 EDT 2002 | scottefiske
Stop the lines...! Stop building defects and rework into your product. Contact Fab Supplier and have pipeline filled for small amount of replacement fabs to keep lines running and limiting production scheduling and impact. Request to have the board
Electronics Forum | Wed May 16 12:08:24 EDT 2001 | raton
Some thoughts- Torque applied to each joint is case specific. I know there are charts and all, but they don't account for YOUR situation such as screwing a fab to a chassis(or your aluminum screw). If the customer sets a spec then use it. (But i
Industry News | 2010-07-22 17:50:38.0
Smart Sonic unveiled the world’s first ultrasonic stencil cleaning process in 1990 at the NEPCON West Show.
Industry News | PCBNPI-Professional PCB Fab/PCB Assembly Service Provider From China
Technical Library | 2015-09-17 17:36:56.0
RoHS legislated restrictions on the materials used in electronics manufacture have imparted significant challenges on the electronics industry since their introduction in 2006. The greatest impacts have been felt by the mandated elimination of lead from electronic solder followed by the demand for the elimination of haloids from flame retardants used in traditional PCB laminates. In the years which have followed the electronics industry has been beset with a host of new challenges in its effort to comply. Failure mechanisms, both new and old, have surfaced which demand solution and the industry suppliers and manufacturing technologists have worked diligently to remedy those vexing faults through the development of a wide range of new materials and equipment for both board manufacture and assembly, along with modifications to the processes used in the manufacture and assembly of printed circuit boards.
Technical Library | 2017-08-31 13:43:48.0
Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Proper optimization of wire bond parameters and machine settings are essential for good yields. Wire bond process can generate a variety of defects such as lifted bond, cracked metallization, poor intermetallic etc. NSOP – non-stick on pad is a defect in wire bonding which can affect front end assembly yields. In this condition, the imprint of the bond is left on the bond pad without the wire being attached. NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes observed and the efforts to address NSOP reduction
SMTnet Express, February 8, 2018, Subscribers: 31,242, Companies: 10,885, Users: 24,377 Mixed Voltages And Aluminum Conductors: Assesing New Electrcal Technology Olivier Neuman; Mentor Graphics The architecture of vehicle electrical systems