CoorsTek Gaiser invented the ceramic bonding tool. Our precision wire bonding tools include ceramic capillaries, wire wedges, ribbon wedges, ceramic/cermet wedges, die collets & vacuum pick-up tools.
Water-based, alkaline defluxing for semiconductor electronics HYDRON® SE 230A is a water-based, single-phase cleaning agent specifically developed for the use in dip tank processes. It removes flux residues from a wide range of semiconductor electro
Water-based, pH-neutral defluxing agent Based on the MPC® Technology, ZESTRON’s latest pH-neutral cleaning agent has been specifically developed for use at low operating concentrations in spray-in-air inline and batch cleaning applications. VIGON®
Electronics Forum | Mon Mar 03 10:38:28 EST 2003 | davef
Electroplated nickel and electroplated gold is the more �traditional� finish for aluminum wire bonding. That surface was an extension of gold thermosonic wire bonding that requires a thick [50 thou min] gold surface. For years fabricators recommend
Electronics Forum | Tue May 13 21:08:24 EDT 2003 | ramanandkini
Dear Sir, Sorry for the delay in reply. This is regarding MIL standard for bond pull strength: MIL-STD-883C dt.25/08/83 Bond strength (destructive bond pull test); refer table-1 Minimum bond strengths for various wire composition & diameter given.
Becoming available soon; K&S 4124 Wire Bonding Machine currently in production to be removed in complete working condition. Contact: Assured Technical Service LLC Minneapolis, MN 55441 AssuredTechnicalServiceLLC@Gmail.com FOB Origin. The
Industry News | 2011-12-21 22:41:39.0
Offering convenient and cost-effective staff development, IPC announces its Winter Webinar Series for January, February and March 2012. The one-hour webinars which focus on critical issues facing the industry, offer companies an opportunity to bring IPC technical information to a large number of employees at one time.
Industry News | 2015-01-19 21:50:28.0
KYZEN’s innovative new product technology team is introducing its new AQUANOX® A4708 pH Neutral Electronic Assembly Cleaning Chemistry in Booth #1011 at the IPC APEX EXPO. The EXPO tales place Feb. 24-26, 2015 at the San Diego Convention Center in California.
Technical Library | 2019-05-23 10:30:22.0
Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.
Technical Library | 2014-07-24 16:26:34.0
Wire bonding a die to a package has traditionally been performed using either aluminum or gold wire. Gold wire provides the ability to use a ball and stitch process. This technique provides more control over loop height and bond placement. The drawback has been the increasing cost of the gold wire. Lower cost Al wire has been used for wedge-wedge bonds but these are not as versatile for complex package assembly. The use of copper wire for ball-stitch bonding has been proposed and recently implemented in high volume to solve the cost issues with gold. As one would expect, bonding with copper is not as forgiving as with gold mainly due to oxide growth and hardness differences. This paper will examine the common failure mechanisms that one might experience when implementing this new technology.
ASCEN PCB separator 620 model uses wedge cutter to shear PCB in line, internal stress decreases to lowest point, even the sensitive SMD modules or capacitance still won`t be influenced, then potential risk on quality is minimized. to avoid
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Electronics Packaging Technology Conference - EPTC 2015
Career Center | , Philippines | Engineering,Technical Support
Electronic manufacturing and Semiconductor equipment programming, sustenance and preventive maintenance. Knowledge in PLC, pneumatics and automated equipment. Desktop, Laptop computer servicing trouble-shooting, repair, hardware and software instal
Career Center | , | 2013-03-07 10:18:07.0
Currently work as Equipment Engineer at Integrated Microelectronics Inc., Philippines handles Line Maintenance Technicians, that performs production equipment setup and sustenance. Implements/creates improvements on assigned area. Maintains group KRA
SMTnet Express, July 24, 2014, Subscribers: 22981, Members: Companies: 13953, Users: 36523 Copper Wire Bond Failure Mechanisms. Randy Schueller, Ph.D.; DfR Solutions Wire bonding a die to a package has traditionally been performed using either
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc Title: Wire Bonding
ACI Technologies, Inc Wedge Bonding Tool Selection Selecting an Appropriate Wedge Bonding Tool for Fine Pitch Application Increasing I/O numbers, device complexity, and product miniaturization
≧3mm Advantage Application Range Separate precise SMD thin board, aluminum PCB, for special board , needs customization . Feature: Apply latest pneumatic design of light weight, the PCB could be separated in one time, with minimum internal stress, especially suitable to separation of precise SMD or thin board