Electronics Forum | Mon Mar 03 10:38:28 EST 2003 | davef
Electroplated nickel and electroplated gold is the more �traditional� finish for aluminum wire bonding. That surface was an extension of gold thermosonic wire bonding that requires a thick [50 thou min] gold surface. For years fabricators recommend
Electronics Forum | Tue May 13 21:08:24 EDT 2003 | ramanandkini
Dear Sir, Sorry for the delay in reply. This is regarding MIL standard for bond pull strength: MIL-STD-883C dt.25/08/83 Bond strength (destructive bond pull test); refer table-1 Minimum bond strengths for various wire composition & diameter given.
Electronics Forum | Mon Mar 17 10:36:04 EST 2003 | davef
Ramanandkini 14 gm versus 5 gm: 14 gm [even 10 gm] sounds better than 5 gm. We get good bond pull XBAR (high teens) and low sigma (
Electronics Forum | Sun Mar 02 12:16:29 EST 2003 | ramanandkini
Recently, one of our new vendor supplied us PCBs with Electroplated Nickel and Gold. We have the other regular source giving us ENIG plating. In both the wirebonding quality is OK. How do we benchmark this? Which one is suitable for production with l
Electronics Forum | Sat Mar 15 20:24:13 EST 2003 | ramanandkini
Thanks Mr.Dave. Sorry for the delay. One of our major prolems in ENIG plated surface is that wire does not stick. For many years we were getting a bond strength of 14 grams in both ENIG and electroplated surfaces. Now one vendor supplies ENIG boards
Electronics Forum | Sun Mar 02 17:40:02 EST 2003 | MA/NY DDave
Hi It sounds like you are in a different country or in the USA a long time ago. I have no idea of the process either is using, so they can be comparable or one can be better than another and lop sided compared to other places. Benchmarking I think
Electronics Forum | Fri Aug 17 11:55:31 EDT 2001 | davef
5uin. Your nickel thickness is fine. Although if you wanted to trade costs, consider giving-up nickel to 150uin thickness, while increasing the gold thickness. Gold over electroless nickel creates brittle joints because of phosphorous in the nicke
Electronics Forum | Wed Mar 17 21:42:19 EST 1999 | Chuck Garth
We are presently aluminum wirebonding to gold plated lands. Our board manufacturer has been very inconsistient in the quality. It seems as though theey are over etched by about half the amount they should be. Can anyone give me the spec's that normal
Electronics Forum | Sun May 26 10:21:46 EDT 2002 | V.RAMANAND KINI
We buy PCBs for aluminium wire bonding. Our PCBs have 0.25 mm square pads for bonding and 0.10 or 0.15 mm gap between circuit traces/tracks. We do not have any problem. Our vendor gives 9 microns of Nickel and 0.03 microns of gold.
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
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