Practical is the exclusive distributor of mechanical samples from Amkor as well as being the leading supplier of samples from Tessera and K&S Flipchip division. Practical prides itself on being the leader in on-time delivery; value added service and
Electronics Forum | Tue Jan 22 11:43:26 EST 2008 | svarg
Good morning, Amkor has just posted the data sheet for the FusionQuad on their website. The link is below: FusionQuad webpage: http://www.amkor.com/Products/all_products/FusionQuad.cfm FusionQuad Data Sheet http://www.amkor.com/Products/all_datash
Electronics Forum | Tue Feb 17 11:36:33 EST 2004 | POC
Try Amkor web page here http://www.amkor.com/products/notes_papers/appnotes_LGA_0902.pdf Regards POC
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2007-10-04 23:11:30.0
LOS ALAMITOS, CA - September 25, 2007 - Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will display its latest technology in booth 510 at the upcoming SMTA International exhibition and conference, scheduled to take place October 7-11, 2007, in Orlando, FL.
Technical Library | 2007-08-02 13:24:23.0
This paper presents the results of a joint - three way study between Amkor Technology, Panasonic Factory Solutions and Spansion in the area of package on package (PoP) board level reliability (BLR) (...) The scope of this paper is to cover the already popular 14 x 14mm PoP package size that provides a 152 pin stacked interface which supports a high level of flexibility in the memory architecture for multimedia requirements.
Technical Library | 2015-12-02 18:32:50.0
(Thermal Compression with Non-Conductive Paste Underfill) Method.The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology.
Events Calendar | Wed Sep 30 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Tempe, Arizona USA
EDPS 2020 Free Virtual Event Electronic Design Process Symposium (EDPS)
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Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Robert Darveaux, Amkor Electronics, Arizona "Thermal and Power Cycling Limits of PBGA Assemblies" 1994: Donald R. Banks, Motorola Semiconductor Division, Texas "Assembly and Reliability of Ceramic Column Grid Array" 1993: Reinard J
