Simplify Dispensing with GPD Global’s Island Series Dispense Platforms Island Series robots give you versatility to do simple, repetitive automation jobs. Work areas range from 300 mm x 400 mm to 400 mm x 400 mm. All Island Series robots are compati
The Helios™ SD-960 Series is developed for medium to large volume dispensing applications in Electronics Assembly, like Thermal Interface Material (TIM), Potting, Gasketing and Sealing. The new Helios™ SD-960 Series (SD-960) handles a broad range of
Electronics Forum | Mon Oct 25 17:06:18 EDT 1999 | William
Mario, If you are looking for a cheap press to do press fit connectors, then you are asking for trouble. Now, and in the long run. ASG out of West Palm Beach makes a very good press. We bought a 5 ton version and are able to press up to about 2500
MC389CY-F3-V MC-389 High-Speed, High-Mix Pick & Place WITH CONVEYOR Heavy-duty, welded steel base frame w/ adjustable foot pads High-precision ball screw X-Y drive mechanism w/ linear encoders Three pick and place heads, each with servo-drive
DEK 03IX automatic solder paste printing machine features advanced up/down k-view vision system, independent control and adjustment of lighting, high-speed moving lens, accurate alignment of PCB PCB and net board. The DEK Horizon 03IX automatic solde
Industry News | 2019-11-06 13:22:08.0
Europlacer’s multi-award-winning atom3 placement machine is not the only exciting exhibit that visitors to Productronica can test drive on stand A2.461.
Industry News | 2019-09-13 07:56:55.0
Nordson ASYMTEK announces that it will demonstrate its Helios™ SD-960 Series Automated Fluid Dispensing System at Bondexpo, Stuttgart, Germany, in Hall 6, stand 6425.
N510028418AA SENSOR EE-SX910-C2J-R 0.5M N610069934AA トレイフィーダ引出部:NPM Tray Feeder Drawing-out Section:NPM N210097292AC BLOCK 0 N610136671AA 全体カバー:NPM-D Whole Cover:NPM-D N610110951AE X-PLATE(F) 0 N210068065AA SPRING 0 N510026562AA WASHER MMSRB6-0
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
Technical Library | 2010-03-23 11:50:22.0
This document discuss how to design SMT stencil base on IPC-7525. Introduction: PCBA (Printed Circuit Board Assembly) is a segment of printed circuit board technology. This segment of printed circuit board industry is concentrated in assemble all the pieces of electronic industry to one piece before output them to market. This segment covers: interconnection technology, package design technology, system integration technology, board and system test technology
E4/E6 is a capable lead free CE certificated reflow oven with 4/6 upper&4/6 bottom individual hot air convection zones, pin chain&mesh belt inline conveyor. It's the best choice to go with small volume pick&place machine like Autotron
Career Center | Riyadh 11623, Philippines | Engineering,Maintenance,Production
PROFESSIONAL EXPERIENCE: Connected in the field of manufacturing/electronics industry experienced in the line, Through Hole and Surface Mount Technology, worked on various Fuji Machines Universal model, such as: CP 643E chip shooter QP 242E chip mou
Career Center | Fort Mill, South Carolina USA | Engineering,Maintenance,Research and Development
Have serviced AMF pinspotters both mechanical and electrical sides; included repair of chassis pc boards to component level. 20 years in this field. Have worked in PCB manufacture with old style board populators and Panasert robots Worked in H
Press Releases Contact us log in english - Americas english - Europe english - South Asia spanish - Americas deutsch français 中文 繁體中文 日本語 한국어 русский Zestron Europe Zestron Americas Zestron East China Zestron South China Zestron South Asia Zestron Japan Zestron Korea Cleaning Applications SMT Electronic Cleaning PCBA Cleaning Stencil and Screen
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