Electronics Forum: applying the expected nr330 (4)

Welcome To CBAR and the Georgia Institute of Technology

Electronics Forum | Fri Mar 10 12:28:24 EST 2000 | Keith Luke

SMTnet extends a warm welcome to the Center for Board Assembly Research (CBAR)at the Georgia Institute of Technology who have joined with SMTnet to provide access to the Electronics Forum through the school's web site. SMTnet is pleased to cooperate

Welcome To CBAR and the Georgia Institute of Technology

Electronics Forum | Fri Mar 10 12:28:24 EST 2000 | Keith Luke

SMTnet extends a warm welcome to the Center for Board Assembly Research (CBAR)at the Georgia Institute of Technology who have joined with SMTnet to provide access to the Electronics Forum through the school's web site. SMTnet is pleased to cooperate

Industry News: applying the expected nr330 (12)

Ravi Parthasarathy, ZESTRON, to Present at the SMTA Capital Expo and Tech Forum

Industry News | 2015-08-26 18:38:24.0

ZESTRON is pleased to announce that Ravi Parthasarathy, Senior Process Engineer, ZESTRON, will present “pH Neutral Cleaning Agents – Market Expectation & Field Performance” at the SMTA Capital Expo and Tech Forum on September 1st.

ZESTRON Americas

In the midst of change - E-Mobility

Industry News | 2018-09-20 10:59:07.0

Emission-free, fully autonomous and networked throughout the entire world as well – that’s more or less what the car of the future will look like. Thanks to rapid progress in the field of electronics, the vision of fully autonomous vehicles – something that seemed inconceivable just a few years ago – is now within our reach.

Scheugenpflug Inc.

Technical Library: applying the expected nr330 (42)

Electrochemical Methods to Measure the Corrosion Potential of Flux Residues

Technical Library | 2017-07-27 16:51:57.0

Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance drops on both cleaned and non-cleaned circuit assemblies. It is well documented in the literature that SIR detects ionic residue and the potential of this residue to cause leakage currents in the presence of humidity and bias. Residues under leadless components are hard to inspect for and to ensure flux residue is totally removed. The question many assemblers consider is the risk of residues that may still be present under the body of components.

KYZEN Corporation

0201 Placement - Only With The Right Team and Tools!

Technical Library | 2003-09-17 02:59:58.0

It appears very logical that the successor of the 0402 size SMD would be the 0201. Curves showing the life-cycle of a body size, from introduction to most used to only for special cases, are very similar for the 1206, 0805, 0603 and 0402. So there is reason to expect that the same will happen with the 0201. Until now there is only little evidence for this, but most technologies come later than expected but faster than expected!

Assembléon

Express Newsletter: applying the expected nr330 (221)

Partner Websites: applying the expected nr330 (15)

Nordson Corporation Enters Agreement to Acquire Micromedics

Nordson ASYMTEK | https://www.nordson.com/en/our-company/news-room/news-releases/nordson-corporation-enters-agreement-to-acquire-micromedics

. Terms of the deal, which is expected to close within approximately 30 days, were not disclosed.     “The Micromedics acquisition fits

Nordson ASYMTEK

Surface Mount International

Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc

respectively is not properly understood yet and cannot be predicted without experimentation under different conditions. Below is brief summary of the expected reaction of common additives specifically with respect to controlling Cu dissolution. 1. Some

Surface Mount Technology Association (SMTA)


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