New Equipment | Assembly Services
Parameter name / model specification / type UL330 UL445 UL530 UL535 Supply voltagePower Supply： AC220V/50/60HZ Supply pressureAir Supply： 5kgf/c㎡ PCB size (mm)： 330*50~250 445*50~330 530*50~390 535*50~460 PCB direction: Left to right（ opetio
Refurbished Yamaha YV100X Pick and Place Machine MC Type YV100X PCB size L460 x W445 mm (Max.), L50 x W50 mm (Min.)or L460 x W335 mm Accuracy +-0.1 mm(Chips), +-0.08 mm Mounting Speed 0.198 sec/chips
Electronics Forum | Fri Mar 12 10:15:18 EST 2010 | adrnbntz
Any one know how to operate a AQ-400CL, SMT400CL cleaning machine, Bought a used one with out manuals... Please need help..need manuals or quick start-troubleshooting guide. Thx. Adrian
Electronics Forum | Sat Sep 20 20:44:57 EDT 2003 | marcelll
I have a problem with an Aqueous AQ400 machine. The pump not working. What I need is a schematic of the control circuit. If somebody have it please email me.
Used SMT Equipment | SMT Equipment
JUKI KE-2080M pick and place machine Placement speed：Chips:15, 400CPH(0.23sec/chip) Ics:4,700CPH(0.7sec/IC) Component mount range:0.4x0.2mm~□745mm or50x150mm Station:80 Power supply:3P/200~415V/3KVA Size:1,400x1, 393x1, 455mm
Used SMT Equipment | Chipshooters / Chip Mounters
Model :KE-2080 Placement speed：Chips:15, 400CPH(0.23sec/chip) Ics:4,700CPH(0.7sec/IC) Component mount range:0.4x0.2mm~□745mm or50x150mm Station:80 Power supply:3P/200~415V/3KVA Size:1,400x1, 393x1, 455mm Weight:1,540kg jenn
Industry News | 2003-05-29 08:30:31.0
Losses halved in the first half year � New organization of electronics group next on the agenda
Industry News | 2014-05-22 15:42:29.0
Baja Bid announces their next online auction. This event includes assets from OneChip Photonics in Kanata, Ontario Canada.
Parts & Supplies | Assembly Accessories
Samsung KSUN CN030 NOZZLES For Pick and Place Machine More SAMSUNG NOZZLES IN STOCK SAMSUNG CP30 M1, M2 , M3 SAMSUNG CP33 XG05 / XH08 / XI14 / AA24 / BA40 SAMSUNG CP40 N045 / N08 / N14 / N24 / N40 / N75 SAMSUNG CP45 FV TN030 /TN040 / TN065 / T
Parts & Supplies | Assembly Accessories
Samsung KSUN CN220 NOZZLES For Pick and Place Machine More SAMSUNG NOZZLES IN STOCK SAMSUNG CP30 M1, M2 , M3 SAMSUNG CP33 XG05 / XH08 / XI14 / AA24 / BA40 SAMSUNG CP40 N045 / N08 / N14 / N24 / N40 / N75 SAMSUNG CP45 FV TN030 /TN040 / TN065 / TN
Technical Library | 2020-04-01 05:52:59.0
Recently, our engineer Peter went to Thailand to provide after-sales support for our customer. In these days, we had installed a SC-900 selective coating line . Moreover, Peter gave patience and meticulous training to their staff, make sure they master the machine usage .Customer and agent are satisfied with our support and give their affirmation to us. SC-900 is a high Performance 4 axis Selective Coating Machine ,which is equipped with high precision servo control system , various valves , CCD system ,material tank weight detecting system etc, which can provide a high efficiency conformal coating process .The maximum coating size can reach 400mm*450mm with SC-900. So far, we've installed several dozen conformal coating line all over the world. It have excellent stability and performance. Check below link to get more info!
Technical Library | 2015-12-02 18:32:50.0
(Thermal Compression with Non-Conductive Paste Underfill) Method.The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology.
SMT Loader&Unloader for load & unload PCB board magazine storage racks GoldLand Electronic Technology Co., Ltd 88#, Nan Ling Road, Xin Qiao, Sha Jing, Shenzhen 518103, China Tel : +86-13823675048 ? Wechat / WhatsApp ? Skype: sophyluo1985 Email:
Events Calendar | Tue May 30 00:00:00 EDT 2023 - Tue May 30 00:00:00 EDT 2023 | ,
Wisconsin Chapter Webinar: 3D Printing Technologies and How It Relates to Our Industry
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Great Lakes Chapter Meeting: Flexible Wave Solder Processes and Optimization
| https://www.wesource.com/pc-board-cleaners/aqueous-batch-cleaner-aq-400/cl-id-001863-3/23/
Aqueous Batch Cleaner AQ-400/CL ID_001863 (3/23): World Equipment Source COMPANY PROFILE FINDER'S PROGRAM R1-Surplus Wesource159 CALL US
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_beamworks_spark400.html
Beamworks Spark 400 Beamworks Spark 400 Selective Laser Solder Several Machines available for sale Equipped with 2-4 lasers Good Condition Solder Paste Dispensing Rotary positive displacement pump with Archimedean screw
