HYDRON® WS 400, based on the FAST® Technology, is an aqueous based cleaning agent specifically designed to remove water-soluble (OA) flux residues from electronic assemblies and is compatible with sensitive metals. Applied at low concentrations (3% t
Aqueous Technologies Batch Cleaners, SCS Ionograph, Aquastorm 100 and 200, Smartsonic, Alpha Metals, Speedline, Electrovert, Technical Devices, Austin American, Unit Design, Westkleen, ECD View our inventory online or call us at 978-790-2774
Electronics Forum | Tue Sep 07 22:38:25 EDT 2010 | aqueous
As with so many things, some brands work very well on high density, low profile assemblies and some do not. Because my company manufactures these machines, I don't want to use this forum as an advertisement so I will recommend the following: 1. Sen
Electronics Forum | Tue Aug 31 18:34:32 EDT 2010 | aqueous
If the batch cleaner is truly closed loop, then 100% of all of the process fluid (water) is captured, filtered (particulate, carbon, resin) and reused. This answer is based on a traditional closed-loop batch cleaning system with an integrated water
Automatic Wash + Rinse + Cleanliness Test + Dry + SPC Lead Free Ready The SMT Series Cleaning Systems include the industry's most powerful batch-format drying system. The SMT series cleaners utilize a combination of convection and radiant heat t
Standard features: Textured polypropylene, scratch-resistant exterior Quick connect plumbing fittings Removable front and rear panels Windows® OS with monitor and keyboard PC closed-loop conveyor speed Orbitally welded stain
Industry News | 2011-09-28 19:48:18.0
Aqueous Technologies has equipped ZESTRON’s US Technical Center in Manassas, VA, with a Trident LD Batch Cleaner.
Industry News | 2016-10-20 19:30:08.0
ZESTRON is pleased to announce that Ravi Parthasarathy, M.S.Ch.E., Senior Application Engineer, ZESTRON Americas, will present “Power Electronics Cleaning - Solvent to pH Neutral: Enhancing Safety, Process Efficiency and Productivity” at the IPC- SMTA High-Reliability Cleaning and Conformal Coating Conference in Rosemont, IL.
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
Technical Library | 2019-05-23 10:38:07.0
Solvent and co-solvent cleaning involves the use of engineered solvents in a vapor phase system. The solvents classically used were Class 1 Ozone Depleting Substances, but new types of solvents have been developed that are less environmentally harmful. In some cases, isopropyl alcohol is used with a co-solvent. In these types of cleaning systems, a cloud of boiling vapor solvent is maintained between a boil sump and a cooling coil. When the items to be cleaned are immersed in the vapor cloud, the solvent condenses on the assemblies and acts to dissolve the residues. These processes usually involve a final rinse step outside of the vapor cloud to ensure that all dissolved residues are washed off the assemblies (Figure 1).
ATRON® SP 200 is an aqueous-alkaline surfactant cleaner, specifically developed to remove baked-on fluxes from solder pallets and condensation traps. ATRON® SP 200 can be used for the removal of unsoldered solder pastes from SMT stencils. The cleaner
"Fast Acting Surfactant Technology" (FAST®) is an innovative surfactant-based cleaning technology developed by ZESTRON. FAST® Technology based cleaning agents are a proprietary mix of newly developed surfactants, which allows for a quicker removal of
Career Center | , Philippines | Engineering,Technical Support
Electronic manufacturing and Semiconductor equipment programming, sustenance and preventive maintenance. Knowledge in PLC, pneumatics and automated equipment. Desktop, Laptop computer servicing trouble-shooting, repair, hardware and software instal
Career Center | , | 2013-03-07 10:18:07.0
Currently work as Equipment Engineer at Integrated Microelectronics Inc., Philippines handles Line Maintenance Technicians, that performs production equipment setup and sustenance. Implements/creates improvements on assigned area. Maintains group KRA
Aqueous SMT600 Aqueous Technologies Batch Cleaner Serial Numbers: 6965 Model Number: SMT600-LD Year 2002 Stainless Steel Interior with Pull Out Wash Basket Wash Dimensions: 20" x 20" x
. Wack Virtual Company Tour Home ZESTRON FA+ ZESTRON FA+ Solvent-based assembly cleaner for defluxing in semi-aqueous processes Solvent-based cleaning agent designed to remove all types of flux residues from electronic assemblies, ceramic hybrids, power electronics