Aqueous Technologies Batch Cleaners, SCS Ionograph, Aquastorm 100 and 200, Smartsonic, Alpha Metals, Speedline, Electrovert, Technical Devices, Austin American, Unit Design, Westkleen, ECD View our inventory online or call us at 978-790-2774
LONOX® L5020 is a high alkaline aqueous PCB cleaning solution designed to cost effectively remove most flux and paste residues from wiring assemblies. LONOX® L5020 offers a low in use cost and long bath life in spray cleaning applications. LONOX® L
Automatic Wash + Rinse + Cleanliness Test + Dry + SPC Lead Free Ready The SMT Series Cleaning Systems include the industry's most powerful batch-format drying system. The SMT series cleaners utilize a combination of convection and radiant heat t
Industry News | 2013-10-01 18:05:58.0
ZESTRON is pleased to announce that ZESTRON’s Application Technology Manager, Umut Tosun, M.S.Chem.Eng., will present “Concentration Monitoring & Closed Loop Control - A Technological Advancement” during the Advancements in Cleaning Process Controls session at SMTAI 2013.
Industry News | 2014-05-12 18:41:54.0
ZESTRON is pleased to announce that Jigar Patel, M.S.Chem.Eng., Senior Process Engineer, ZESTRON, will present “Concentration Monitoring and Closed Loop Control – A Technological Advancement” at the SMTA Wisconsin Expo and Tech Forum on May 13th, at the Milwaukee Airport Crowne Plaza.
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
The first technology to use centrifugal energy to clean electronic circuit assemblies, precision parts, and semiconductor packages. The system offers unparalleled penetration, solubilization, and contaminant removal The MicroCel Centrifugal Cleanin
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HANDLING OF MAINTENANCE Camelot,Mascot, Selective Soldering,Wave Soldering,Aquastorm 200,H-500 HI-Z,Kolb,kerry&PBT,GETECH, ATI 105 & Final Touch 101,Heller,Btu&vapour phase,Shuttle,SRT,ESD ,Electrical maintenance . Knowledge in using SLIM KIC 2000&
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• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat
Aqueous Technologies Trident III Duo Batch Wash Cleaner-2010 - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart. Subtotal
: 13 gallons Include Dell Computer Tower, Touch Screen Monitor, and Manuals Location: Boston, MA Price: $13,500 Aqueous Technologies PCB Wash See more photos below Home SMT & PCB Equipment