Industry Directory | Manufacturer
Nett Technologies Inc. is a manufacturer of emission solutions using diesel oxidation catalyst (DOC), diesel particulate filter (DPF), selective catalytic reduction (SCR)system technologies.
Industry Directory | Manufacturer
Located in an area which offers low costs and access to a highly skilled, productive and cost-effective labour pool we provide flexible manufacturing services with a true customer-centric philosophy.
Affordable Manufacturing Execution System (MES), Shop Floor Automation and Integration Software CELLS WORKFLOW Product Tracking MES is an affordable full Manufacturing Process Control Software System providing Plant Intelligence for any industry.
The OmniES™ is proven to exceed lead-free profile requirements and delivers efficient high performance thermal processing. IsoThermal™ Chamber Technology The OmniES offers a combination of innovation and industry-proven technologies in
Electronics Forum | Mon Jun 27 03:40:44 EDT 2011 | samsim
Other areas you can focus 1) Find out alternative chemical and solder materials for lower cost. 2) Set high power consumption machine (such as Oven and wave) to idle mode when not running to cut electrical consumption. 3) Reduce the used of N2 gas.
Electronics Forum | Fri Nov 09 14:42:08 EST 2001 | vickt
Great advice!........Single tier feeder set-up carts are also available through Universal instruments directly for this exact purpose. Most people who really care about this changeover time have "pit-crews" that work in the component storage areas, o
Used SMT Equipment | Depanelizers / Routers
The Cencorp TR5000 series accommodates a wide range of depaneling processes including tab reduction, routing in pallets, full board routing, and output to flat belt or downstream automation or packaging systems. This unit is located in the CEE faci
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Parts & Supplies | Chipshooters / Chip Mounters
JUKI 104 NOZZLE E35047210A0 JUKI E93277210A0 ENCODER TRUNK CABLE ASM. JUKI E93277250A0 TRUNK CABLE ASM. JUKI E93277260A0 Y MOTOR ASM JUKI E93277290A0 OCC LIGHT RELAY CABLE ASM. JUKI E9327729BA0 OCC LIGHT RELAY CABLE ASM JUKI E93278550A0 WINDING SW
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Parts & Supplies | Pick and Place/Feeders
JUKI 2010 E93237290A0 SERIAL PARALLEL CABLE ASM. Other juki parts: E93227270A0 DETECTOR SENSOR(C)ASM E93227290A0 SERIAL PARALLEL CABLE ASM. E9322729AA0 SERIAL PARALLEL CABLE ASM. E93228020A0 PLACE SENSOR CABLE ASM. (1) E93228550A0 VACUUM DOWN S
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
www.unisoft-cim.com/cells.html - CELLS WORKFLOW is affordable, simple to setup & use yet powerful product & job tracking software for fast New Product Introduction (NPI). The CELLS WORKFLOW software provides total traceability in manufacturing floor
Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,
Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures
Career Center | Buffalo, New York USA | Engineering,Production,Quality Control,Technical Support
The Process Engineer will lead overall improvement in the area of yield enhancement, reduction in non-conforming components and assemblies, as well as cost saving initiatives. An important attribute of this position is the use of SPC for variation i
Career Center | San Diego, California USA | Engineering
Kodak - A Design & Product Testing Engineer is responsible for oversight of ink jet printer projects being conducted by the Testing and Customer Assurance area. Oversight includes assurance of the data integrity as well as effective collection, redu
Career Center | San Pedro Sula, Cortes Honduras | Engineering,Maintenance,Management,Technical Support
Preventive maintenance on SMT machines. Corrective maintenance on SMT Machines Schedule of preventive maintenance programs. Minimum Inventory control for spare parts Automation process on SMT Lines Work Instructions for maintenance procedur
Career Center | , | Engineering,Maintenance,Production
Production Planning ~ Supply Chain Management ~ Productivity Management ~ Sub Contracting Management ~ Process Quality Management ~ Process innovation & Lean Mfg ~ Cost efficiency Management ~ Manpower Management ~Multi Skilling & Training, Six Sigma
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/02/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
Vacuum-assisted reflow with convection heating utilizes continuous operation thermal profiles for low COO and high UPH. Recent customer installation showed 10X reduction in voids, meeting specification of <1% total void area
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. The Weibull plot illustrates the influence of planar microvoiding on thermal fatigue reliability. The imbedded planar or flat section photomicrographs show the reduction in solder joint attachment area caused by planar voiding
