General Electric GIVEN YOUR BEST ! PLEASES mailto:firstname.lastname@example.org Contact: Sandy Lin Email:email@example.com Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 General Electric Company is an Americanmultinati
Spare parts for Universal Radial and Axial through-hole insertion machines (RAD5 6360D, RAD8 6380A, RAD8 XT 6380B, VCD5 6241D, VCD8 6241F, VCD Dual 6292A, SEQ 2596A, SEQ5, SEQ8). UIC Part Number / Part Description 15754 O'RING 15755 O'RING 15759
Industry News | 2017-05-26 14:54:11.0
Versatile Hotbar Bonding System with Motorized Rotary Table for Precision Positioning
Industry News | 2010-02-19 09:45:37.0
Pressurex® Sensor Film Needed to Measure Contact Pressure In Ultrasonic Welding
JUKI inlet and outlet sensor 40002208 40002214 Other juki parts: 40002194 PN1 CABLE ASM 40002196 PN3 CABLE ASM 40002197 HOD R232C CABLE ASM 40002200 CD-HDD I/F CABLE ASM 40002203 OPEPANE S/P CABLE ASM 40002204 R-OPEPANE SWICTH CABLE ASM 40002
DEK Printing Machine Accessories Solder Paste Machine Accessories Track Import and Export Blocks DEK Printing Machine Accessories Solder Paste Machine Accessories Track Import and Export Blocks Ms:Mandy Email:firstname.lastname@example.org Mb/whatsapp
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 2014-05-29 13:48:14.0
Electronics packaging based on stress-engineered spring interconnects has the potential to enable integrated IC testing, fine pitch, and compliance not readily available with other technologies. We describe new spring contacts which simultaneously achieve low resistance ( 30 μm) in dense 2-D arrays (180 ~ 180-µm pitch). Mechanical characterization shows that individual springs operate at approximately 150-µN force. Electrical measurements and simulations imply that the interface contact resistance contribution to a single contact resistance is This paper suggests that integrated testing and packaging can be performed with the springs, enabling new capabilities for markets such as multichip modules.
.We have large quantity stock and good source for Feeders/ feeder spare parts, feeder trolleys, Nozzles, Heads, Servo Motors, Drivers, Control boards and other related parts for Siemens/ASM/SIPLACE X-Series machine(such as
& SMT Rework Through-Hole & Hand Assembly Depanel & Other PCBA PCB Conveyors Spare Parts SMT Pick and Place machines are an essential part of the PCB assembly process for most manufacturers, which is why Capital Equipment Exchange offers a large