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SMT X Ray machine SMT X Ray inspection machine X Ray machine SMT X Ray machine PCB quality inspection machine PCB x ray machine PCB inspection machine Product description: SMT PCB X Ray machine, PCB quality inspection equipment INQUIRY
The 850 DWMS (Die Wire Metrology System) provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum defect, and measurement capabilities for Lead-Frame, Die and Wire-
Hover-Davis Direct-Die Feeders for wafer-packaged semiconductor and MEMS devices extract and present .7mm up to 11mm die from 100, 150, 200, and 300mm wafers. DDF2 facilitates flexible single-wafer loading while the new DDF3 includes cassette loading
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst
Precision IC & Power Mold Parts Precision Trim/Form Tooling (Tool steel & Carbide) Jigs & Fixtures Punches & Inserts Spare Parts For Bonding Machines (Clampers, Cutter, Indexing Finger, Anvil Block etc.) Spare Parts For Machines Stamping Tools/ Dies
Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protecte
Chip assembly? Classic SMT placement? Our SIPLACE CA can do both. The SIPLACE CA is the world's first placement platform that combines bare-die placement directly from the wafer and classic SMT placement in a single machine and a single production
Dispensing nozzle tip also known as writing pen is used to dispense the glue to the die location with the compressed air in most of dispensing process, such as die bonding, electrical circuit connection, structural and circuit board connection. To e
Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product description: Yamaha Flip Chip Bonde,Hybrid Placer, Yamaha flip chip bonding,Yamaha die bo
