Precision Engineered Ceramics, Inc. produces precision machined ceramic spares for semiconductor wafer processing equipment. In addition, we offer fast delivery of complex geometry ceramic components made from high purity aluminum oxide (alumina).
Quik-Pak, a division of GEL-PAK, offers state of the art clean room manufacturing and enhanced product capabilities which include MLF and MLP IC plastic packages. Quik-Pak offers unlimited open cavity plastic package configurations. Quick-Turn dicing
Nitril gloves,PVC gloves,Latex gloves One-off molding, no seam design, scarcely generates particles. Disposable nitril glove,latex glove, PVC glove can apply in clean room that up to class 100 or calss1000. Wear comfortable, soft feeling and
Electronics Forum | Wed Mar 02 07:47:57 EST 2016 | deanm
Sounds like over molding would be ideal, but if they don't want to spend for a mold I would look at silicone conformal coatings that can be used in a dip process. Silicones are thicker than other coating materials and multiple drippings may provide t
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
ASM SIPLACE D1i / C3180-12041108 Number of placement heads: 2 or 1 IPC speed: 13.000cph SIPLACE benchmark evaluation: 15.000cph Theoretical speed: 20.000cph Range of components (mm²): 01005 to 200x125 Mounting head features: 6n
Siemens placement machine D4I, SIPLACE D4i high-speed placement machine Model description: 1. Number of cantilevers: 4 2. Number of placement heads: 4 3. IPC speed: 57.000cph 4. SIPLACE benchmark evaluation: 66.000cph 5. Theoretical speed: 81.50
Industry News | 2009-02-02 18:48:47.0
Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.
Deflection pulley, ungeared,injec.mold.
03054923-02 ASM Nozzle 2033 240 pcs 03059921-02 ASM Nozzle 2038 120 pcs 03037746-01 ASM Hood axis 5 pcs K3035K Fuji Grease (NSK GRS NS7 80g) 5 pcs 2MGTHA067900 Fuji Filter 500 pcs MX100562 (DEK 141146) Matrix/ASM AFB-LF grease THK 50 pcs 800280
Technical Library | 2017-12-07 10:35:50.0
Electronics manufacturers protect their circuit boards with conformal coatings. Conformal coatings serve as a barrier from environmental hazards and internal shorts, tin whiskers, and corrosion at the board level. Within conformal coatings different material chemistries specialize in shielding from an array of hazards and can be applied by multiple methods. The most common method is atomized spray which disperses the material into a fine mist. Alternatively, non-atomized coating controls the materials' dispense shape while maintaining the original liquid form. While some applications demand atomized spray and other scenarios overlap between atomized and non-atomized coating, this paper focuses on the circumstances where materials are ideally suited for non-atomized, selective coating.
Technical Library | 2015-09-23 22:08:32.0
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. (...) Flip chip bonding of bare die on MID can be employed to fully utilize MID’s advantage in device miniaturization. Compared to the traditional soldering process, thermo-compression bonding with gold stud bumps provides a clear advantage in its fine pitch capability. However, challenges also exist. Few studies have been made on thermocompression bonding on MID substrate, accordingly little information is available on process optimization, material compatibility and bonding reliability. Unlike solder reflow, there is no solder involved and no “self-alignment,” therefore the thermo-compression bonding process is significantly more dependent on the capability of the machine for chip assembly alignment.
Low Pressure Molding with Macromelt. Low pressure molding is an innovative manufacturing process between injection molding and potting. A cost effective and environmentally friendly alternative to epoxy potting for fragile electronic components. When
. Mold operations or thermal effects on materials. Software utilities enable the seamless import of offset data into the placement system