Industry Directory: asm silver wire bonder (2)

CMTec AG

CMTec AG

Industry Directory | Equipment Dealer / Broker

CMTec is highly specialized in dealing with assembly equipment. We support BESI (ESEC, Datacon), Kulicke & Soffa, Hesse & Knipps, F&K Delvotec, Orthodyne, ASM, Dage and others. CMTec delivers 'turn-key' projects worldwide.

Chengdu Yeheng Electronics Co.,Ltd

Chengdu Yeheng Electronics Co.,Ltd

Industry Directory | Manufacturer of Assembly Material / Other / Assembly / Component Packaging / OEM

More than 17 years manuafacture experience in designing,producing of wire bonding tools- wire guide,cutter,wedge,clamp finger,and OEM seivice available.ISO 9001approved and CE SGS certificated.Selfowned patent.

New SMT Equipment: asm silver wire bonder (5)

GE BENTLY NEVAD 3300/20-05-03-01-00-00 DUAL THRUST MONITOR 25-0-25MILS

GE BENTLY NEVAD 3300/20-05-03-01-00-00 DUAL THRUST MONITOR 25-0-25MILS

New Equipment | Industrial Automation

  Sandy.[mailto:unity@mvme.cn]    Sandy.[WhatsApp/Skype/Mobile:+8618020776786]     Sandy.[Quote to you within the shortest possible time with our best price]   Warranty: up to 12 months Shipping: fast delivery is available NEW+ORIGINAL+IN STOCK+ONE

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

PFTL 101AE-0.5

PFTL 101AE-0.5

New Equipment | Industrial Automation

PFTL 101AE-0.5 PFTL 101AE-0.5 ZhongHaiDe (Fujian) Industrial Equipment Co., Ltd., is located in the center of the provincial capital of Fujian Province, relying on the advantages of customs declaration in Mawei Free Trade Zone of Fuzhou, specializi

zhonghaide(fujian)industrial equipmentCO.,LTD.

Electronics Forum: asm silver wire bonder (9)

gold wire bonding

Electronics Forum | Wed Dec 28 16:03:53 EST 2005 | Chris

I have lots of experience with thermosonic gold ball bonding. You can read the literature and you will probably find some papers that say you can do it. I have never been able to do it. We gold ball bond all day long with little problems at all bu

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef

This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R

Used SMT Equipment: asm silver wire bonder (4)

Industry News: asm silver wire bonder (3)

Hesse Mechatronics Launches Heavy Wire and Ribbon Bonding Services for Early Stage Product Development

Industry News | 2013-05-06 18:13:00.0

Hesse Mechatronics will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder at the company’s west coast demonstration and applications lab, located at long-time company manufacturer's representative Chalman Technologies in Anaheim, California.

Hesse Mechatronics

TopLine Sponsors IMAPS Wire Bonding Conference

Industry News | 2018-03-13 18:47:01.0

TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.

TopLine Dummy Components

Parts & Supplies: asm silver wire bonder (7)

Juki 11272408 THRUST COLLAR

Parts & Supplies | Pick and Place/Feeders

JUKI 40047977 Z-THETA SIGNAL CABLE ASM FUJINTAI TECHNOLOGY CO.,LTD JUKI 40047980 NOZZLE DOWN RELAY CABLE ASM www.fujintai.com JUKI 40047981 BAD MARK FIBER AMP ASM FUJINTAI TECHNOLOGY CO.,LTD JUKI 40047982 NOZZLE UP SV ASM www.fujintai.com JUKI 40

FUJINTAI TECHNOLOGY CO.,LIMITED

Juki 40000405 CASTER

Parts & Supplies | Pick and Place/Feeders

JUKI 40047977 Z-THETA SIGNAL CABLE ASM FUJINTAI TECHNOLOGY CO.,LTD JUKI 40047980 NOZZLE DOWN RELAY CABLE ASM www.fujintai.com JUKI 40047981 BAD MARK FIBER AMP ASM FUJINTAI TECHNOLOGY CO.,LTD JUKI 40047982 NOZZLE UP SV ASM www.fujintai.com JUK

FUJINTAI TECHNOLOGY CO.,LIMITED

Technical Library: asm silver wire bonder (9)

Copper Wire Bond Failure Mechanisms.

Technical Library | 2014-07-24 16:26:34.0

Wire bonding a die to a package has traditionally been performed using either aluminum or gold wire. Gold wire provides the ability to use a ball and stitch process. This technique provides more control over loop height and bond placement. The drawback has been the increasing cost of the gold wire. Lower cost Al wire has been used for wedge-wedge bonds but these are not as versatile for complex package assembly. The use of copper wire for ball-stitch bonding has been proposed and recently implemented in high volume to solve the cost issues with gold. As one would expect, bonding with copper is not as forgiving as with gold mainly due to oxide growth and hardness differences. This paper will examine the common failure mechanisms that one might experience when implementing this new technology.

DfR Solutions

Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences

Technical Library | 2009-01-15 00:42:58.0

Tin-silver-copper has received much publicity in recent years as the lead-free solder of choice. SAC305 was endorsed by the IPC Solder Value Product Council in the United States as the preferred option for SMT assembly; most assemblers have transitioned to this alloy for their solder paste requirements. The SAC305 alloy due to its 3.0% content of silver is expensive when compared to traditional 63/37 for this reason many wave assemblers are opting for less costly options such as tin-copper based solders for their wave, selective and dip tinning operations.

Kester

Career Center - Resumes: asm silver wire bonder (3)

Equipment Maintenance Technician

Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support

                                                 Duties & Responsibilities (Equipment Technician):  Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment.  Conduct Preventive maintenance

Experienced Technical Specialist

Career Center | , Philippines | Engineering,Technical Support

Electronic manufacturing and Semiconductor equipment programming, sustenance and preventive maintenance. Knowledge in PLC, pneumatics and automated equipment. Desktop, Laptop computer servicing trouble-shooting, repair, hardware and software instal

Express Newsletter: asm silver wire bonder (803)

Partner Websites: asm silver wire bonder (8)

Semiconductor

1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_smt_pcb_semiconductor.html

    Laurier Wafer Die Sorter DS6000-8 Full Information SOLD   ESEC 2006 Die Bonder Full Information SOLD   ESEC 3006 Wire Bonder Full Information SOLD              Home     SMT & PCB Equipment

1st Place Machinery Inc.


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