Industry Directory: asm wire bonder eagle (2)

CMTec AG

CMTec AG

Industry Directory | Equipment Dealer / Broker

CMTec is highly specialized in dealing with assembly equipment. We support BESI (ESEC, Datacon), Kulicke & Soffa, Hesse & Knipps, F&K Delvotec, Orthodyne, ASM, Dage and others. CMTec delivers 'turn-key' projects worldwide.

Chengdu Yeheng Electronics Co.,Ltd

Chengdu Yeheng Electronics Co.,Ltd

Industry Directory | Manufacturer of Assembly Material / Other / Assembly / Component Packaging / OEM

More than 17 years manuafacture experience in designing,producing of wire bonding tools- wire guide,cutter,wedge,clamp finger,and OEM seivice available.ISO 9001approved and CE SGS certificated.Selfowned patent.

New SMT Equipment: asm wire bonder eagle (51)

GE BENTLY NEVAD 3300/20-05-03-01-00-00 DUAL THRUST MONITOR 25-0-25MILS

GE BENTLY NEVAD 3300/20-05-03-01-00-00 DUAL THRUST MONITOR 25-0-25MILS

New Equipment | Industrial Automation

  Sandy.[mailto:unity@mvme.cn]    Sandy.[WhatsApp/Skype/Mobile:+8618020776786]     Sandy.[Quote to you within the shortest possible time with our best price]   Warranty: up to 12 months Shipping: fast delivery is available NEW+ORIGINAL+IN STOCK+ONE

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

ABB GDB021BE GD B021 BE  HIEE300766R1 Gate Control Unit

ABB GDB021BE GD B021 BE HIEE300766R1 Gate Control Unit

New Equipment | Industrial Automation

Sales Manager: Sandy Lin Email: unity@mvme.cn Skype:onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 ​​​ yuehang:  Shipping Term : TNT,DHL,FEDEX,ETC Payment Term : T/T Warranty: 12 month yuehang supply: New+original+factory sealed+high quality

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Electronics Forum: asm wire bonder eagle (8)

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef

This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R

ASM Bonder

Electronics Forum | Sun Nov 06 14:12:07 EST 2005 | Danmens

I am looking for someone very familiar with ASM wire-bonders (AB356) to train us after hours on a temporary basis. You must reside in MA, NH or RI. Send an e-mail if you are interested. dmendoza@mnc.com

Used SMT Equipment: asm wire bonder eagle (5)

Industry News: asm wire bonder eagle (1)

ASM Pacific Technology Announces 2020 Annual Results

Industry News | 2021-03-15 15:34:56.0

ASM Pacific Technology Limited ("ASMPT" / the "Group") (Stock code: 0522) announced its annual results for the year ended 31 December 2020. ASMPT's technologies enable its diverse range of customers to create a wide range of semiconductor and electronic products and services for the digitally-enabled world.

ASM Pacific Technology

Technical Library: asm wire bonder eagle (2)

Copper Wire Bond Failure Mechanisms.

Technical Library | 2014-07-24 16:26:34.0

Wire bonding a die to a package has traditionally been performed using either aluminum or gold wire. Gold wire provides the ability to use a ball and stitch process. This technique provides more control over loop height and bond placement. The drawback has been the increasing cost of the gold wire. Lower cost Al wire has been used for wedge-wedge bonds but these are not as versatile for complex package assembly. The use of copper wire for ball-stitch bonding has been proposed and recently implemented in high volume to solve the cost issues with gold. As one would expect, bonding with copper is not as forgiving as with gold mainly due to oxide growth and hardness differences. This paper will examine the common failure mechanisms that one might experience when implementing this new technology.

DfR Solutions

Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices

Technical Library | 2015-09-23 22:08:32.0

A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. (...) Flip chip bonding of bare die on MID can be employed to fully utilize MID’s advantage in device miniaturization. Compared to the traditional soldering process, thermo-compression bonding with gold stud bumps provides a clear advantage in its fine pitch capability. However, challenges also exist. Few studies have been made on thermocompression bonding on MID substrate, accordingly little information is available on process optimization, material compatibility and bonding reliability. Unlike solder reflow, there is no solder involved and no “self-alignment,” therefore the thermo-compression bonding process is significantly more dependent on the capability of the machine for chip assembly alignment.

Flex (Flextronics International)

Career Center - Resumes: asm wire bonder eagle (3)

Equipment Maintenance Technician

Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support

                                                 Duties & Responsibilities (Equipment Technician):  Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment.  Conduct Preventive maintenance

Experienced Technical Specialist

Career Center | , Philippines | Engineering,Technical Support

Electronic manufacturing and Semiconductor equipment programming, sustenance and preventive maintenance. Knowledge in PLC, pneumatics and automated equipment. Desktop, Laptop computer servicing trouble-shooting, repair, hardware and software instal

Express Newsletter: asm wire bonder eagle (789)

Partner Websites: asm wire bonder eagle (5)

Semiconductor

1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_smt_pcb_semiconductor.html

    Laurier Wafer Die Sorter DS6000-8 Full Information SOLD   ESEC 2006 Die Bonder Full Information SOLD   ESEC 3006 Wire Bonder Full Information SOLD              Home     SMT & PCB Equipment

1st Place Machinery Inc.


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