ZK Electronic Technology Co., Limited professional in Surface-Mount Technology area and supports most major brands of electronic asembly equipments with a large selections of compatible SMT.
The DispenseJet DJ-9500 supports a long list of jettable fluids for a wide range of applications. Incorporating over 15 years of jetting experience, the DJ-9500 jet provides even more capability than its DJ-9000 predecessor. Nordson ASYMTEK's jettin
Jetting is the best way to dispense many fluids quickly and accurately. The DJ-9000 has a high shot-generation rate, can be cleaned in a few minutes, and has fast changeover of wetted parts. Speed, Flexibility, Process Control, Experience Based on
Electronics Forum | Mon May 26 08:23:49 EDT 2014 | mun4o
hi all, we have smd line with 2 Assembleon topaz X.The real speed of the line is about 12- 13k cph.I want to increase this speed.I intend to buy a Assembleon sapphire and change one of topaz with sapphire ( chip shooter).Has anyone of you similar c
Electronics Forum | Thu May 29 22:06:24 EDT 2014 | proy
Hi You might want to join and post this on my Yahoo Assembleon users group, it is new so we only have 6 or so members, but as it grows it will be more and more useful. My 2c worth is that a sapphire might be kind of old and problematic for support
Industry News | 2009-12-19 09:07:25.0
Nr.1 supplier of pre-owned Assembleon Pick and Place equipment
Industry News | 2010-01-18 10:26:33.0
Now operational in BELGIUM
1 KHY-M7106-A0 HEAD SHAFT 1 ASSY. 5 2 KHY-M7106-00 BALL SPLINE 1 5 3 KHY-M7107-A0 HEAD SHAFT 2 ASSY. 5 3-1 KHY-M7106-B0 HEAD SHAFT 1B ASSY. 5 (2009/1/14) MF10029 OK 4 KHY-M7107-00 BALL SPLINE 2 5 4-1 KHY-M7106-00 BALL SPLINE 1 5 (2009/1/14) MF10
Technical Library | 1999-08-27 09:29:49.0
Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective...
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
FOR SALE: Assembleon / Yamaha Opal XII smt pick and place pcb assembly machine running production. This machine is available fully functional from the Capital Equipment Exchange. http://www.ce-exchange.com/detail/assembleon-opal-xii-flex-placer-48
Career Center | Timisoara, timis Romania | Engineering,Maintenance,Technical Support
Working as a service engineer at ICCO EMT for more than 10 years experience in service activities in Eastern Europe for pick and place systems from Assembleon starting 2000 in all major EMS sites, beginning 2006 involved in evaluation (first system o
2011 Assembleon MG-1R Pick and Place - Pre-owned & For sale - Baja Bid Skip to content Your EMS Asset Management Partner Careers
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