The SC-300 Swirl Coat® applicator offers three modes of operation - bead, monofilament and swirl. Ideal for conformal coating applications, the SC-300 handles a wide range of materials, varying in viscosity from 30 to 3500 mPa-sec (30 to 3500 centipo
Jetting is the best way to dispense many fluids quickly and accurately. The DJ-9000 has a high shot-generation rate, can be cleaned in a few minutes, and has fast changeover of wetted parts. Speed, Flexibility, Process Control, Experience Based on
Electronics Forum | Mon May 11 17:05:15 EDT 2015 | gregcr
Hi All, I have an old Asymtek AUTOMOVE 402 that actually worked pretty good. The PC died on it and I'm trying to get things running again. I have the DOS software, but I figure if I'm going to set it up I may want to get newer software. 1. Do you
Industry News | 2018-01-08 18:24:10.0
Nordson ASYMTEK announces that it has acquired the rights and assets to progressive cavity pump (PCP) product lines from Infiniti Dosing o.m.s, based in Polling, Germany. The transaction, which closed on January 5, 2018, provides Nordson ASYMTEK with dispensing and dosing products marketed by Infiniti under the Dot Streamer (DS) and Accura brands. Infiniti's owner and founder, Mr. Jean-Claude Tytgat, will join Nordson ASYMTEK and continue to work on technology developments.
Industry News | 2015-05-21 22:04:20.0
Nordson ASYMTEK announces that registration for its 2015 Technology Days is now open. The event will focus on how innovation and continuous technological developments in fluid dispensing, jetting, and conformal coating improve the way companies bring their products to market. Technology Days is being held in Maastricht, The Netherlands on June 17 and 18, 2015.
Ｙ軸 ユニット Y-AXIS UNIT ....番号 Ref.No. 部品コード Parts Code 部品名 Parts Name Serial No. 個数 Q'ty 備考 Remarks 同期 Repl. 1 2-108-571-01 .......... BUSHING, POSITIONING 2 2 2-697-044-04 G200 ..... -. MAIN FRAME, G200 1 3 4-705-
SOLENOID VALVE / EJECTOR / AIR CYLINDER PCS245YNBD24SP SOLENOID VALVE 14 KURODA PCS242 / DC 24V SOLENOID VALVE 23 KURODA PMS2406 / DC24V SOLENOID VALVE 3 KURODA PCS2408 SOLENOID VALVE 1 KURODA PCS245 / DC24V SOLENOID VALVE 6 KURODA AS2406 SOLENOID
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 1999-08-27 09:29:49.0
Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective...
Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000. http://www.nordsonasymtek.com
Career Center | , Philippines | Engineering,Technical Support
Electronic manufacturing and Semiconductor equipment programming, sustenance and preventive maintenance. Knowledge in PLC, pneumatics and automated equipment. Desktop, Laptop computer servicing trouble-shooting, repair, hardware and software instal
Career Center | Fort Worth, Texas USA | Engineering,Maintenance,Production,Quality Control,Research and Development
A mechanically-inclined, results-oriented, lean-driven professional with proven success in implementing programs that result in efficiencies and cost savings. Effectively communicates with diverse audiences, encourages training and employee developme
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+ Asymtek 910 Mydata MY100 Seica S40 Flying Probe *Used Semiconductor Equipment: Toray CF1000R Flip Chip Line , ESEC 3006 , Laurier DS6000 , Fusion Systems UV Curing Oven , ESEC 2006 , GSI Lumonics Laser , EVG Anodic Bonder , Clean Room Products CRP C-1006 , Datacon DS9000
A leader in automated fluid dispensing, jetting and conformal coating. Products range from benchtop dispensers and stand-alone dispensing workstations to fully automated, in-line conveyorized systems.
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