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Electronics Forum | Tue Aug 27 09:26:59 EDT 2013 | felo188
Hello, I have a problem with SMEMA communication between LSB 03 PCB destacker and DECK 265. Unfortunatelly LSB have 37-pin SMEMA socket. I am trying to make adapter. Based on datasheets of LSB and IPC SMEMA 9851. I tried various combinations but w
Electronics Forum | Mon Sep 02 23:56:08 EDT 2013 | dekhead
Looks like too many signals there for a DEK SMEMA board to handle; trying to translate / ascertain what signals those are, to offer possibilities to communicate with DEK; However would pretty much guarantee a need for hardware change (personality car
Industry News | 2021-06-08 09:22:40.0
Baja Bid is hosting an online auction event featuring items from: Mydata, DEK, Vitronics, Universal and much more. The bidding period began yesterday, June 7, at 8:00am EST. The bidding period will begin closing tomorrow, June 9, at 1pm EST.
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Technical Library | 2014-03-27 14:32:24.0
The surface finish you select will have a large influence on quality, reliability and cost. It is a complex decision that impacts many areas of the business. Select a finish that optimal for the business (and not just one function). Know that there are engineering tricks to improve on weak areas of each finish. Stay current in this field because new developments continue to be made.
Technical Library | 2020-01-15 23:54:34.0
Flexible electronics has significantly advanced over the last few years, as devices and circuits from nanoscale structures to printed thin films have started to appear. Simultaneously, the demand for high-performance electronics has also increased because flexible and compact integrated circuits are needed to obtain fully flexible electronic systems. It is challenging to obtain flexible and compact integrated circuits as the silicon based CMOS electronics, which is currently the industry standard for high-performance, is planar and the brittle nature of silicon makes bendability difficult. For this reason, the ultra-thin chips from silicon is gaining interest. This review provides an in-depth analysis of various approaches for obtaining ultra-thin chips from rigid silicon wafer. The comprehensive study presented here includes analysis of ultra-thin chips properties such as the electrical, thermal, optical and mechanical properties, stress modelling, and packaging techniques. The underpinning advances in areas such as sensing, computing, data storage, and energy have been discussed along with several emerging applications (e.g., wearable systems, m-Health, smart cities and Internet of Things etc.) they will enable. This paper is targeted to the readers working in the field of integrated circuits on thin and bendable silicon; but it can be of broad interest to everyone working in the field of flexible electronics.
. The material exchange is done autonomously by robots (AIV). ASYS has extended the functionality of the line loader AES 03 Speed so that it can remove assemblies from magazine locations as well as bare PCBs from the stack and feed them into the line
Vocabulary Contact Us Quote now 0 NextPCB email@example.com 0086-755-83643663 +86 15013838486 firstname.lastname@example.org Blog >> Blog Details Page How to deal with the interference of circuit board parasitic components on circuit performance Posted:03