Processing and Troubleshooting SMT, BGA, CSP and Flip Chip
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
. Three surface finishes including OSP, ImAg, and ENIG are considered. The test vehicle consists of 15mm and 6mm Ball Grid Array (BGA) components. The assembled test boards were isothermally aged at 125oC for 12 months, which are then thermally cycled between -40oC to
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/about-us/news/nordson-asymtek-next-generation-dispensing-and-systems-and-software-on-display-at-ipc-apex-2016
dispensing system handles BGA, CSP, underfill , PCBA , dam and fill, encapsulation , potting, dotting, precise coating , and other applications, including those that need dual lanes or action
