ATC, as a PCB manufacturer with many customers including leading electronic and semiconductor companies, domestic and overseas, are endeavoring to meet and even lead the needs of the market as well as customers and advance our technologies further.
Industry Directory | Consultant / Service Provider / Manufacturer
We provide extensive embedded hardware and software for ARM based microcontroller, such as development board, emulator,etc.
Fast Smart Modular Mounter RS-1R standard 150mm conveyor extensions, 250mm conveyor extensions, upstream and downstream upstream and downstream Board siz
JUKI ATC PICK UP NOZZLE For more information please visit our website
Electronics Forum | Wed May 26 18:54:10 EDT 2004 | Dreamsniper
PILLARHOUSE RUBY, EMERALD atc.
Electronics Forum | Fri Nov 04 10:17:16 EST 2005 | Amol
i though they had a accleration factor as a relationship between ATC and actual life cycles
Used SMT Equipment | Pick and Place/Feeders
JUKI Mounter fx-1r parameters: Board size: 410*360mm Component height: 6mm 33,000CPH：chip (optimal) / 25,000CPH: chip (IPC 9850) Two independent multi-nozzle laser heads (8 total nozzles) from 0603 （0201） to 20mm square components or 26.5×
Used SMT Equipment | In-Circuit Testers
Aeroflex IFR ATC-601-2 Ramp Test Set Portable and reliable ramp tester noted for ease of use. - See more at: https://www.testequipmentconnection.com/72101/Aeroflex_IFR_ATC-601-2.php#sthash.vvpWKDik.dpuf
Industry News | 2014-10-12 19:48:10.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, IL.
Industry News | 2011-08-24 17:13:21.0
The IPC Conference on Reliability: Assembly Process for a Reliable Product will be held November 1-2, 2011, in Irvine, Calif. The conference will address reliability issues that arise at the assembly level, dedicating half-day programs on new developments in each of three key areas: materials, processes, and test and inspection.
Juki FX1R stop sensor L825E1210A0 Specs: JUKI FX1R stop sensor L825E1210A0: E94677250A0 OUT SENSOR CABLE ASM E94637250A0 IN SENSOR CABLE ASM E94667250A0 C.OUT SENSOR CABLE ASM E94657250A0 STOP SENSOR CABLE ASM E95517250A0 F FEED
Juki FX1R stop sensor L825E1210A0 Specs: E94677250A0 OUT SENSOR CABLE ASM E94637250A0 IN SENSOR CABLE ASM E94667250A0 C.OUT SENSOR CABLE ASM E94657250A0 STOP SENSOR CABLE ASM E95517250A0 F FEEDER FLOATING CABLE ASM E95567250A0
Technical Library | 2021-09-08 14:10:12.0
The Pb-Free Alloy Characterization Program sponsored by International Electronics Manufacturing Initiative (iNEMI) is conducting an extensive investigation using accelerated temperature cycling (ATC) to evaluate ball grid array (BGA) thermal fatigue performance of 12 commercial or developmental Sn based Pb-free solder alloys. This paper presents the initial findings from a specific subset of the temperature cycling test matrix. The focus is on comparing alloy performance for two of the most commonly specified temperature cycles, 0 to 100 °C and -40 to 125 °C.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
40001264 EJECTOR BASE 60 ASM 40001265 EJECTOR BASE 60 40001266 EJECTOR 60 40001269 HEAD MAIN PCB BASE 60 40001270 HMS PCB SUPPORT 60 40001279 ATC BASE PLATE 40001283 SLIDE PLATE 40001284 SLIDE PLATE GUIDE 40001285 GUIDE SPACER 40001286 ATC S
E93057270A0 X ORG SENSOR ASM E93057290A0 XR ENC X AXIS RELAY CABLE ASM E93058550A0 F SQUEEGEE UP SENSOR ASM. E93067000A0 CRT CABLE ASM E93067150A0 HEAD MOTOR CABLE 3 ASM. E93067210A0 MOTOR ASM. E93067250A0 L THETA HEAD MOTOR ASM.) E93067270A0 #NAME?
Career Center | Quito, Ecuador | Sales/Marketing,Technical Support
Technical Sales (machinery, animal and plant protection products). Sales Forecast New Products (Bsss Diffusion Model).
Career Center | Bangalore, Karnataka India | Sales/Marketing
Dear Mam / Sir, Greetings, My 22 years of Sales & Business Development experience in “Capital Equipments” (Plastic processing m/c's, Turn-key packaging m/c’s, etc.) should be of interest to a fast growing company like yours. My experience in vario
