Schneider Electric Schneider Electric SA, founded by Schneider brothers in 1836, is one of the world's top 500 enterprises.Its headquarters are in ruie, France. Schneider electric is a global leader in energy efficiency management, providing in
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Industry News | 2002-03-13 18:44:07.0
April 2-4, 2002
Industry News | 2002-04-29 17:50:50.0
May 22-24, 2002
H66817 NXT3 4M Vacuum Pump DOP-400SA Maintenance Kit .AA6SB05 REFERENCE PIN 2.2MGKSA003602 ROLLER (OF AJ92609 HARNESS) 3.A5053C O-RING 4. 2MGKHA014800 O-RING 5 .A5188Z O-RING PIA (4.0*1.0(FKM70)) 4.2SGKZC001300 5.XS03690 7.2MGKHA03510* NXT se
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2013-04-25 11:42:01.0
Specification and control of surface roughness of copper conductors within printed circuit boards (PCBs) are increasingly desirable in multi-GHz designs as a part of signal-integrity failure analysis on high-speed PCBs. The development of a quality-assurance method to verify the use of foils with specified roughness grade during the PCB manufacturing process is also important... First published in the 2012 IPC APEX EXPO technical conference proceedings.
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