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Electronics Forum | Mon Jan 29 12:42:24 EST 2001 | davef
Several points about your query are: * TI�s solderability protection specification is a minimum of 3 u" of palladium over 40-60 u" of nickel plate over a http://www.ti.com/sc/docs/products/logic/package/palladm/index.htm
Electronics Forum | Fri May 09 08:27:35 EDT 2014 | emeto
REduction of center pad is the key as well as the stencil thickness. Having too big opening on your stencil will sometimes lift the part from the pads. Always try to make windowpane and shoot for about 60% of the thermal pad to be covered as start p
Industry News | 2009-03-20 17:24:43.0
TORRANCE, CA � March 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will exhibit Sayaka PCB Routers in booth 1035 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.
Industry News | 2008-08-07 12:32:07.0
COLORADO SPRINGS, CO � August 2008 � Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, announces that it will exhibit TV-1000 TWEEZER-VAC, DTV-2000 TWEEZER-VAC and VSPT series of small parts tips in booth 326 at the upcoming SMTA International exhibition and conference, scheduled to take place August 19-20, 2008, at Disney's Coronado Springs Resort and Convention Center in Orlando, FL.
. Temperature rising rate during preheating stage: In terms of heating stage, low temperature rising rate from room temperature to melting point is expected to reduce most of the defects
. I will try the new version, but since these boards are already finished and they utilized approx 60 footprints created by the older version, what do I need to do to propagate this fix into my designs