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Electronics Forum | Mon Jan 29 12:42:24 EST 2001 | davef
Several points about your query are: * TI�s solderability protection specification is a minimum of 3 u" of palladium over 40-60 u" of nickel plate over a http://www.ti.com/sc/docs/products/logic/package/palladm/index.htm
Electronics Forum | Fri May 09 08:27:35 EDT 2014 | emeto
REduction of center pad is the key as well as the stencil thickness. Having too big opening on your stencil will sometimes lift the part from the pads. Always try to make windowpane and shoot for about 60% of the thermal pad to be covered as start p
Industry News | 2009-03-20 17:24:43.0
TORRANCE, CA � March 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will exhibit Sayaka PCB Routers in booth 1035 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.
Industry News | 2008-08-07 12:32:07.0
COLORADO SPRINGS, CO � August 2008 � Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, announces that it will exhibit TV-1000 TWEEZER-VAC, DTV-2000 TWEEZER-VAC and VSPT series of small parts tips in booth 326 at the upcoming SMTA International exhibition and conference, scheduled to take place August 19-20, 2008, at Disney's Coronado Springs Resort and Convention Center in Orlando, FL.
Technical Library | 2009-07-01 09:24:25.0
During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new methodology has been recently developed to further increase the propensity for successful cleaning.ii At the core of this method is the thermal identification of the residue matrix. Thermal energy changes the physical state, i.e. transitions between liquid, solid and gas phases. By taking advantage of such specific information during phase transitions, the cleaning process can be tailored to such settings, which in turn increases the cleaning success significantly.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
(10g/L): N/A (Solvent-Based) Flash Point: None to Boiling Boiling Point: 216°F / 102°C Water Soluble: Soluble VOC, @ 100% 221 g/L NOTE: The above process parameters are recommendations based on extensive testing done in
. I will try the new version, but since these boards are already finished and they utilized approx 60 footprints created by the older version, what do I need to do to propagate this fix into my designs