New SMT Equipment: ati point to point 60 (138)

Siemens Simatic 6ES7441-2AA01-0AE0 CP441-2 for Point to Point Module

Siemens Simatic 6ES7441-2AA01-0AE0 CP441-2 for Point to Point Module

New Equipment | Dispensing

Contact Emma  E: T: +86-18030273592  (whatsapp/Wechat/Skype)    Packaging & Shipping  1. Delivery within 2-3 working days after payment. 2. Professional anti-static bag packaging.

Gaibian Automation Co. Ltd

ABB NKTU01-14 I/O Module to Termination Unit Cable

ABB NKTU01-14 I/O Module to Termination Unit Cable

New Equipment | Industrial Automation

ABB NKTU01-14 I/O Module to Termination Unit Cable CONTACT US: SKYPE:ariatang111 MB(WHATSAPP):+86-18020776791 WECHAT:18020776791        Our services  Packing & Delivery 1)100% full New! - Original

Moore Automation

Electronics Forum: ati point to point 60 (5)

Poor wetting to palladium

Electronics Forum | Mon Jan 29 12:42:24 EST 2001 | davef

Several points about your query are: * TI�s solderability protection specification is a minimum of 3 u" of palladium over 40-60 u" of nickel plate over a

LGA... where to start?

Electronics Forum | Fri May 09 08:27:35 EDT 2014 | emeto

REduction of center pad is the key as well as the stencil thickness. Having too big opening on your stencil will sometimes lift the part from the pads. Always try to make windowpane and shoot for about 60% of the thermal pad to be covered as start p

Used SMT Equipment: ati point to point 60 (3)

JOT 1M Point to Point Conveyor

JOT 1M Point to Point Conveyor

Used SMT Equipment | Conveyors

Model: J204-02032 Vintage: 1999 Details: • 1M Point to Point conveyor • Crank width adjust • 110-120v – 50/60Hz

Lewis & Clark

ATI Point to Point 60 inch

ATI Point to Point 60 inch

Used SMT Equipment | Conveyors


Recon Inc

Industry News: ati point to point 60 (23)

Seika Machinery to Showcase Sayaka PCB Routers at APEX 2009

Industry News | 2009-03-20 17:24:43.0

TORRANCE, CA � March 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will exhibit Sayaka PCB Routers in booth 1035 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.

Seika Machinery, Inc.

Virtual Industries to Showcase Key Technologies and Products at SMTA International 2008

Industry News | 2008-08-07 12:32:07.0

COLORADO SPRINGS, CO � August 2008 � Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, announces that it will exhibit TV-1000 TWEEZER-VAC, DTV-2000 TWEEZER-VAC and VSPT series of small parts tips in booth 326 at the upcoming SMTA International exhibition and conference, scheduled to take place August 19-20, 2008, at Disney's Coronado Springs Resort and Convention Center in Orlando, FL.

Virtual Industries, Inc.

Technical Library: ati point to point 60 (31)

Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution

Technical Library | 2009-07-01 09:24:25.0

During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new methodology has been recently developed to further increase the propensity for successful cleaning.ii At the core of this method is the thermal identification of the residue matrix. Thermal energy changes the physical state, i.e. transitions between liquid, solid and gas phases. By taking advantage of such specific information during phase transitions, the cleaning process can be tailored to such settings, which in turn increases the cleaning success significantly.

ZESTRON Americas

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.


Express Newsletter: ati point to point 60 (222)

Partner Websites: ati point to point 60 (590)

AQUANOX A8820D - Ready to Use Advanced Stencil Cleaner


(10g/L): N/A (Solvent-Based) Flash Point: None to Boiling Boiling Point: 216°F / 102°C Water Soluble: Soluble VOC, @ 100% 221 g/L NOTE: The above process parameters are recommendations based on extensive testing done in

How To Specify Plated Holes? - PCB Libraries Forum - Page 2

PCB Libraries, Inc. |

.  I will try the new version, but since these boards are already finished and they utilized approx 60 footprints created by the older version, what do I need to do to propagate this fix into my designs

PCB Libraries, Inc.

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