Electronics Forum: attaced (1)

BGA drop off from the boards

Electronics Forum | Fri May 23 23:45:38 EDT 2014 | edriansyah

Hi Evtimov. 1. yes both part and the process are lead free/RoHS 2. I ever did X-ray, the balls shape are good and I dont see any evident of head in pillow (but my x-ray machine is not too good) Head in pillow was also my first suspect. but after the

Used SMT Equipment: attaced (1)

Mydata MY9

Mydata MY9

Used SMT Equipment | SMD Placement Machines

1.) Serial number 5458 THE PICTURE IN ATTACED . 2.) Operating hours and/or number of placed components TIME TOTAL MOUNT 3 DAYS 22 HOURS THE PICHTURE IN ATTACHED . 3.) vVsion/camera systems 1 CAMERA SVC STANDARD . 1 CAMERA HRC HIGHT

Ital Electronics

Parts & Supplies: attaced (14)

Juki  FEEDER SPARE PARTS JUKI FTFR FEEDER UPPER COVER 3232OP E6203706RBC

Juki FEEDER SPARE PARTS JUKI FTFR FEEDER UPPER COVER 3232OP E6203706RBC

Parts & Supplies | Assembly Accessories

SMT MACHINE GENUINE JUKI FEEDER SPARE PARTS JUKI FTFR FEEDER UPPER COVER 3232OP E6203706RBC JUKI Pats Specifications: Brand Name JUKI FTFR FEEDER UPPER COVER 3232OP Part number E6203706RBC Model JUKI FEEDER SPARE PARTS Ensure Test in machi

KingFei SMT Tech

Fuji NXT COPY NEW NOZZLE list attac

Parts & Supplies | Pick and Place/Feeders

      P/N                                Model R07-007-070              H08/H12   0.7     nozzle R07-010-070              H08/H12    1.0    nozzle R07-013-070              H08/H12   1.3    nozzle R07-013M-070 Melf   H08/H12   1.3M    nozzle

Goldland Electronic Technology Company Limited

Technical Library: attaced (3)

Organic Flip Chip Packages for Use in Military and Aerospace Applications

Technical Library | 2006-11-14 12:48:31.0

Content: 1. Bridge from Commercial Reliability 2. Existing PBGA use in Aerospace & Military 3. Drivers: Plastic versus Ceramic Package Weight 4. Attributes of PTFE and Thin Core FC Packages 5. Flip Chip Package Reliability 6. Flip Chip Package

i3 Electronics

Process Optimization for Fine Feature Solder Paste Dispensing

Technical Library | 2018-12-19 21:23:59.0

With the rapid trend towards miniaturization in surface mount and MEMs lid-attach technology, it is becoming increasingly challenging to dispense solder paste in ultra-fine dot applications such as those involving chip capacitors or BGA packages, as well as dispensing ultra-fine lines in MEMs lid-attach applications. In order to achieve ultra-fine dots and fine line widths while dispensing solder paste, both the solder material and dispensing equipment need to be optimized. Optimizing the equipment can be very challenging, as there are many input variables that can affect the dispense quality of the solder paste. In this paper we will evaluate the many equipment variables involved in the solder paste dispensing process, and the impact these variables have on the dispense quality of the solder paste.

Indium Corporation


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