Industry News | 2014-05-22 15:42:29.0
Baja Bid announces their next online auction. This event includes assets from OneChip Photonics in Kanata, Ontario Canada.
Industry News | 2014-06-03 13:04:15.0
The OneChip Photonics facility in Kanata; Ontario, Canada will be closing their site and all assets are being sold via an online auction. The bidding for the auction will open promptly at 4:00am EST on June 3, 2014 with Lots 1-512 beginning to close at 11am EST on June 4, 2014.
Industry News | 2003-05-05 09:13:55.0
Reliable Wire Bonders for High Yield Production
Industry News | 2013-03-06 10:33:14.0
Hesse Mechatronics (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, formally announces the company's recent name change from Hesse & Knipps, Inc. to Hesse Mechatronics, Inc., effective January 1, 2013.
Industry News | 2013-03-06 10:36:50.0
Hesse Mechatronics, Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, formally announces the company's recent name change from Hesse & Knipps, Inc. to Hesse Mechatronics, Inc., effective January 1, 2013.
Industry News | 2013-06-07 14:37:14.0
Hesse Mechatronics will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.
Industry News | 2012-08-02 11:15:11.0
Hesse & Knipps, Inc., (www.hesse-knipps.com) has strengthened its customer support and wedge bonder representation throughout Northwestern United States and Canada with the appointment of Prospect Technical Sales that will now support the company’s family of wedge bonders in Nevada, Oregon, Washington, Montana, Utah, Colorado, Northern California as well as the Canadian provinces of British Columbia and Alberta.
Industry News | 2013-04-13 00:16:30.0
Hesse Mechatronics has appointed Michael McKeown as Senior Business Development Manager. Michael will be in charge of strengthening Hesse Mechatronics’ position in the power electronics market.
Industry News | 2013-06-20 19:12:14.0
Tresky, announces that it will display the T-6000 Flexible Automatic Die Bonder in Booth #5770 at the 2013 SEMICON West exhibition & conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. Tresky will co-exhibit with XYZTEC.
Industry News | 2012-09-04 08:51:32.0
Hesse & Knipps, Inc., (www.hesse-knipps.com) has added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders to support growing requirements for high density module bonding.
