Industry Directory: automatic wafer (6)

Milara Inc

Milara Inc

Industry Directory | Manufacturer of Assembled PCBs

The Company is dedicated to the development, manufacturing, servicing and/or licensing of manual, semi automatic and automatic stencil/screen printers, dispensers, and wafer printers for the Surface Mount Technology (SMT) and Semiconductor Industries

Retronix Semiconductor

Retronix Semiconductor

Industry Directory | Turnkey / Equipment Dealer / Broker

Retronix Semiconductor is an experienced global engineering services and general contractor company serving the semiconductor and high tech manufacturing industries. We offer flexible labor, equipment and facility support.

New SMT Equipment: automatic wafer (220)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

Camera Module Cleaning Machine ETA-C800

New Equipment | Cleaning Equipment

Camera Module Cleaning Machine ETA-C800 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCBA Cleaning Machine, On-line PCBA Cleaning Machine

Shenzhen ETA Technology Co., Ltd

Electronics Forum: automatic wafer (4)

COB Process (Chip On Board)

Electronics Forum | Tue Nov 05 06:51:59 EST 2002 | V.RAMANAND KINI

Hi, This is a widely discussed subject and since you have asked a brief explanation, I assume, you are a business man or a top executive in the company venturing in to COB. I waited to see if someone replies to you. May be it is a very old subject

Screen Printer

Electronics Forum | Tue Aug 02 15:05:38 EDT 2011 | davef

A couple of points: * Just a nit, 'screens' fell in disuse 10-15 years ago. Old habits die slowly don't they? * Yes, DEK and MPM each hold about 50% of the solder paste printer market and about 4 or 5 others hold the rest. SOLDER PASTE PRINTER EQUI

Used SMT Equipment: automatic wafer (9)

Disco DFL-7161

Used SMT Equipment | Semiconductor & Solar

Fully Automatic Laser Wafer Saw for 4" / 6" / 8" wafer size

GES Associates LLC

Disco DFL-7161

Used SMT Equipment | Semiconductor & Solar

Fully Automatic Laser Wafer Saw for 4" / 6" / 8" wafer size

GES Associates LLC

Industry News: automatic wafer (133)

Virtual Industries Announces Availability of new WAFER-VAC System

Industry News | 2013-04-22 16:33:35.0

Virtual Industries Inc., announces the availability of its new WAFER-VAC system with 8" molded wafer tip (WV-9000-MW8).

Virtual Industries, Inc.

Virtual Industries to Debut New WV-9000 WAFER-VAC System at SEMICON West

Industry News | 2012-06-11 12:58:50.0

Virtual Industries Inc.announces that it will debut the new WV-9000 WAFER-VAC System for handling wafers and solar cells in Booth #2427 South at the upcoming SEMICON West conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.

Virtual Industries, Inc.

Parts & Supplies: automatic wafer (7)

Fuji CNSMT [K3031X] Grease MULTEMP SRL (400G) Lubricant FUJI mounter

Fuji CNSMT [K3031X] Grease MULTEMP SRL (400G) Lubricant FUJI mounter

Parts & Supplies | Assembly Accessories

CNSMT [K3031X] Grease MULTEMP SRL (400G) Lubricant FUJI mounter CNSMT [K3031X] Grease MULTEMP SRL (400G) Lubricant FUJI mounter Mass sales of mounter parts CP4 mounter vacuum valve Mounter / SMT Automatic Solder Paste Mixer Mounter 12MM Feede

CNSMT CO.LTD

Fuji CNSMT FUJI H1124F H63468 VQZ342 XPF Working Head Solenoid Valve

Fuji CNSMT FUJI H1124F H63468 VQZ342 XPF Working Head Solenoid Valve

Parts & Supplies | Assembly Accessories

CNSMT FUJI H1124F H63468 VQZ342 XPF Working Head Solenoid Valve CNSMT FUJI H1124F H63468 VQZ342 XPF Working Head Solenoid Valve Mass sales of mounter parts CP4 mounter vacuum valve Mounter / SMT Automatic Solder Paste Mixer Mounter 12MM Feede

CNSMT CO.LTD

Technical Library: automatic wafer (28)

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Technical Library | 2020-01-28 00:23:58.0

This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.

Heller Industries Inc.

Ceramic to Plastic Packaging

Technical Library | 2019-06-05 11:11:06.0

As electronic products increase in functionality and complexity, there is an emphasis on affordability, miniaturization, and energy efficiency. The telecommunications, automotive, and commercial electronic markets are the leading drivers for these trends. These markets see high volume manufacturing with millions of units priced to the fraction of the cent. The choice of the packaging material for the electrical components for these markets can have a substantial effect on the cost of the final product. Therefore plastic encapsulated components are almost universally used in non-military applications over the conventional ceramic or metal electronic packages.

ACI Technologies, Inc.

Videos: automatic wafer (6)

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Videos

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

Ideal solution for 300mm (12 inch) wafer testing

Ideal solution for 300mm (12 inch) wafer testing

Videos

The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages available in the industry, to reach all positions on the wafer with the t

XYZTEC bv

Career Center - Resumes: automatic wafer (2)

SMT process engineer

Career Center | NORTHRIDGE, California USA | Engineering

EDUCATION BS Electronics and Communication Engineering                Gujarat University MS Electrical Engineering        California State University, Northridge  ACADAMIC PROJECT Fabrication and Characterization of Silicon Carbide (SiC) MESFE

Quality Control/Production and Management

Career Center | Melbourne, Florida USA | Management,Production,Quality Control

Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude

Express Newsletter: automatic wafer (322)

A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing

A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing Printer-hosted processes for solder ball placement

Screen and Stencil Printing Processes for Wafer Backside Coating

Screen and Stencil Printing Processes for Wafer Backside Coating News   Forums   SMT Equipment   Company Directory Calendar   Career Center   Advertising   About   FREE Company Listing! Screen and Stencil Printing Processes for Wafer Backside

Partner Websites: automatic wafer (1142)

Automatic Nozzle Calibration

GPD Global | https://www.gpd-global.com/co_website/features-nozzlecalibration.php

Automatic Nozzle Calibration   Home   Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader

GPD Global

FINEPLACER® femto 2 - Automatic Sub Micron Bonder for Product Development and Production - Southwest

| https://www.swsystems.com/news/fineplacer-femto-2-automatic-sub-micron-bonder-for-product-development-and-production/

Automatic Sub Micron Bonder for Product Development and Production FINEPLACER ® femto 2 features a placement accuracy of up to ± 0.5 µm @ 3 Sigma and supports a wide range of assembly applications at chip and wafer level


automatic wafer searches for Companies, Equipment, Machines, Suppliers & Information

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