Optimizing Flip Chip Substrate Layout for Assembly Optimizing Flip Chip Substrate Layout for Assembly High-density flip chip applications are commonly limited by the available substrate technologies. Accordingly, considerable design efforts
SMTnet Express, June 8, 2017, Subscribers: 30,461, Companies: 10,609, Users: 23,346 Low-Cost Inkjet Printing Technology for the Rapid Prototyping of Transducers Bruno Ando, Salvatore Baglio, Vincenzo Marletta, Antonio Pistorio; DIEEI
SMTnet Express, January 14, 2016, Subscribers: 23,987, Members: Companies: 14,894, Users: 39,724 Now Available: Amendments for J-STD-001F and IPC-A-610F In order to keep up with industry demand, IPC has released
