Industry Directory: avoid popcorn bga (2)

Taiwan Dry Tech Corp.

Taiwan Dry Tech Corp.

Industry Directory | Other / Antistatic / Components / Substrates / Environmental Resources / Service Provider

Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.

SMT Dry Cabinets by Eureka Dry Tech

SMT Dry Cabinets by Eureka Dry Tech

Industry Directory | Manufacturer of Assembly Equipment / Assembly / Component Packaging / Component Preparation / Tape and Reel Services

Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD,PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.

New SMT Equipment: avoid popcorn bga (83)

NexJet NJ-8 Jetting System with ReadiSet Jet Cartridge

NexJet NJ-8 Jetting System with ReadiSet Jet Cartridge

New Equipment | Dispensing

The NexJet® 8 Jetting System with ReadiSet™ Jet Cartridge offers increased jet frequency combined with advanced consumable management - it's as easy as ReadiSet and Jet. ReadiSet Jet Cartridge reduces operator training time, cost-of-ownership, and

Nordson ASYMTEK

DJ-9000 DispenseJet Jet Technology

DJ-9000 DispenseJet Jet Technology

New Equipment | Dispensing

Jetting is the best way to dispense many fluids quickly and accurately. The DJ-9000 has a high shot-generation rate, can be cleaned in a few minutes, and has fast changeover of wetted parts. Speed, Flexibility, Process Control, Experience Based on

Nordson ASYMTEK

Electronics Forum: avoid popcorn bga (146)

Have any paper or data talking about "BGA Stencil design guideline for avoid bridge"?

Electronics Forum | Thu Sep 06 05:25:38 EDT 2018 | spoiltforchoice

I'm no expert but I think you will find the majority of discussions around BGA & good printing results focus on the PCB design and things like tented vias and pad definition. e.g https://macrofab.com/blog/bga-pad-creation-smd-nsmd/ After that, work

Have any paper or data talking about "BGA Stencil design guideline for avoid bridge"?

Electronics Forum | Thu Sep 06 03:43:00 EDT 2018 | cmchoue

Dear Experts, Have any paper or data talking about the design guideline for avoiding BGA solder bridge? I desire to know the rule(guideline)that compare difference stencil thickness and safe solder design distance (air gap) can avoid bridge.

Industry News: avoid popcorn bga (25)

Seika Machinery to Feature HIROX Digital Microscopes at IMAPS/NASA/JPL Topical Workshop & Exhibition

Industry News | 2009-09-17 16:43:33.0

TORRANCE, CA — September 2009 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, together with HIROX-USA, announces that it will highlight the HIROX series of digital microscopes at the IMAPS/NASA/JPL Topical Workshop & Exhibition on Counterfeit Electronic Parts; Awareness, Avoidance, Detection and Mitigation, scheduled to take place Thursday, October 1, 2009 at the Radisson Hotel in Los Angeles.

Seika Machinery, Inc.

MIRTEC Europe and pb tec solutions to Display Revolutionary 2D/3D AOI Technology at SMT/Hybrid/Packaging 2015

Industry News | 2015-04-07 11:25:45.0

MIRTEC will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7A-504, at the SMT/Hybrid/Packaging 2015 exhibition, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.

MIRTEC Corporation

Parts & Supplies: avoid popcorn bga (3)

Agilent Full-automatic BGA Ball Mounti

Agilent Full-automatic BGA Ball Mounti

Parts & Supplies | Repair/Rework

main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr

Goodluck Electronic Equipment Co.,Ltd

Agilent Full-automatic BGA Ball Mounti

Agilent Full-automatic BGA Ball Mounti

Parts & Supplies | Repair/Rework

main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr

Goodluck Electronic Equipment Co.,Ltd

Technical Library: avoid popcorn bga (106)

Advanced Solder Paste Dispensing

Technical Library | 2008-10-15 20:16:12.0

Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.

Nordson ASYMTEK

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.

Nordson ASYMTEK

Videos: avoid popcorn bga (7)

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000.

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000.

Videos

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000. http://www.nordsonasymtek.com

Nordson ASYMTEK

NexJet NJ-8 System with ReadiSet Jet Cartridge

NexJet NJ-8 System with ReadiSet Jet Cartridge

Videos

The NexJet® 8 System with ReadiSet™ Jet Cartridge offers increased jet frequency combined with advanced consumable management - it's as easy as ReadiSet and Jet. Read more at http://www.nordsonasymtek.com/nexjet

Nordson ASYMTEK

Career Center - Resumes: avoid popcorn bga (1)

3+ years of experience in the PCB CAM engineering

Career Center | Erode, Tamilnadu India | Engineering

Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou

Express Newsletter: avoid popcorn bga (489)

SMTnet Express - June 12, 2014

SMTnet Express, June 12, 2014, Subscribers: 22834, Members: Companies: 13899, Users: 36331 Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow Arijit Roy; World Academy of Science, Engineering

Partner Websites: avoid popcorn bga (105)

Milprobes for BGA, SMT, Through Hole

Beau Tech | https://www.beautech.com/bt_milprobes.pdf

Milprobes for BGA, SMT, Through Hole B EA U TEC H , IN C . 98 ELM ST. PO RTLA N D , M E 04101 U SA Please fax the following info to 207-775-7710

Beau Tech

PCB Libraries Forum : Collapsing vs: Non-Collapsing BGA Balls

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_collapsing-vs-noncollapsing-bga-balls_topic1868.xml

-  Here is a non-collapsing BGA ball with a solder mask defined pad. IPC has guidance to avoid this, but it's impossible for pin pitches below

PCB Libraries, Inc.


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