Technical Library | 2013-07-02 16:44:31.0
AOI and AXI systems can address multiple tasks in various locations of the manufacturing process and have become the leading technologies in the quest to identify defects and improve process yields.
Technical Library | 2007-11-01 17:16:07.0
This paper discusses micro-filled epoxy-based conducting adhesives modified with nanoparticles, conducting polymers, and low melting point (LMP) fillers for z-axis interconnections, especially as they relate to package level fabrication, integration,
Technical Library | 2023-10-09 16:10:02.0
This document provides high-level PCB design, sensor mounting, and handling guidelines for TDK IMU devices, which incorporate a combination of gyroscopes and accelerometers. Each sensor has specific requirements to ensure the highest performance in a finished product. For a layout assessment of your design, including placement and estimated temperature disturbances, please contact TDK. The TDK IMU devices discussed in this document (ICM-40607x, ICM-40608, ICM-42xxx, ICM-43xxx, and ICM-45xxx products) consist of 3-axis MEMS gyroscopes and 3-axis MEMS accelerometers.
Technical Library | 2013-08-07 21:52:15.0
PCB architectures have continued their steep trend toward greater complexities and higher component densities. For quality control managers and test technicians, the consequence is significant. Their ability to electrically test these products is compounded with each new generation. Probe access to high density boards loaded with micro BGAs using a conventional in-circuit (bed-of-nails) test system is greatly reduced. The challenges and complexity of creating a comprehensive functional test program have all but assured that functional test will not fill the widening gap. This explains why sales of automated-optical and automated X-ray inspection (AOI and AXI) equipment have dramatically risen...
Technical Library | 2009-01-01 16:37:38.0
Recent technology advancement has enabled enhancement in PWB electrical performance and wiring density. These innovations have taken the form of improved materials, novel PWB interconnect structures, and manufacturing technology. One such advancement is Z-axis conductive interconnect. The Z-interconnect technology involves building mini-substrates of 2 or 3 layers each, then assembling several mini-substrates together using conductive paste.
Technical Library | 2008-02-26 15:02:19.0
More and more chip packages need multi-GHz RF structures to meet their performance targets. The ideal chip package needs to combine RF features with Digital features for these applications. They drive low-loss, controlled impedance transmission lines, flexibility in assigned signal and power layers, and clearances of various shapes in power layers. Building these features in a chip package is difficult without making the stack-up very thick or compromising the reliability of the product. In the present paper, we have designed and built a flip-chip package test vehicle (TV) to make new RF structures, using Z-axis interconnection (Zinterconnect) building blocks.
Technical Library | 2020-04-01 05:52:59.0
Recently, our engineer Peter went to Thailand to provide after-sales support for our customer. In these days, we had installed a SC-900 selective coating line . Moreover, Peter gave patience and meticulous training to their staff, make sure they master the machine usage .Customer and agent are satisfied with our support and give their affirmation to us. SC-900 is a high Performance 4 axis Selective Coating Machine ,which is equipped with high precision servo control system , various valves , CCD system ,material tank weight detecting system etc, which can provide a high efficiency conformal coating process .The maximum coating size can reach 400mm*450mm with SC-900. So far, we've installed several dozen conformal coating line all over the world. It have excellent stability and performance. Check below link to get more info!
Technical Library | 2017-05-04 17:35:01.0
Most of today's printed circuit board base materials are anisotropic and it is not possible to use a simple method to measure thermal conductivity along the different axis, especially when a good accuracy is expected. Few base material suppliers' datasheet show X, Y and Z thermal conductivities. In most cases, a single value is given, moreover determined with a generic methodology, and not necessarily adapted to the reality of glass-reinforced composites with a strong anisotropy.After reminding of the fundamentals in thermal science, this paper gives an overview of the state-of the art in terms of thermal conductivity measurement on PCB base materials, and some typical values. It finally proposes an innovative method called transient fin method, and associated test sample, to perform reliable and consistent in plane thermal conductivity measurement on anisotropic PCB base materials.
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