New Equipment | Solder Paste Stencils
MPM UP2000 HiE Screen Printer Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps
Front End and Back End Yaskawa Wafer Robots, Ebara Pumps, Boc Edwards Pumps, Affinity Chillers, ASM, Karl Suss, Agilent, Tencor, EVG, GSI, ESEC, Besi, Kulicke and Soffa, K&S, MRSI, Temptronic View our inventory or call us at 978-790-2774
New Equipment | Board Handling - Conveyors
Using Lei Sai step control system, precision screw, stable and reliable performance. SMT line body with less NG board can be realized. Can be adjusted according to the height of the specific front and back position machine. It is used for AOI or
Complete web presence from the front page graphics to back end databases.
For applications requiring continuous operation, worths with high temperature and pressure installation and has blowout protection available on both front and back end of sensor.
Semiconductor related resources for the semiconductor industry, ranging from the front-end process to the back-end. Free Listing Available!
Semiconductor related resources for the semiconductor industry, ranging from the front-end process to the back-end. Free Listing Available!
New Equipment | Assembly Services
Product includes the SMT component and also the DIP component. After SMT/DIP production, the product needs the back end manual assembly and AOI check.
Front End: Previously owned (new & used) equipment used for fabrication of semiconductor wafers and similar devices. Includes coater/developers, CVD, PECVD, etch tools, steppers, sputtering tools, ashers, evaporators. Back End: Previously owned (
Our Tacky Flux includes No-Clean and Water-Solube types, only for dispensing ( named of Soldering Flux) in Back-End Ball-Attach process, and SMT & BGA repair or rework, PoP, Stud Bumping (Golden Bumping) etc, Key benefit : 1) regular flux shot and
