New SMT Equipment: backward compatibility (125)

MACH-Vision(tm)

MACH-Vision(tm)

New Equipment |  

The Reliable Controls MACH-Vision is an LCD based user controller that gives operators yet another simple, flexible, and economical solution to access, control and monitor their building environments. It is a fully programmable, 5 input by 4 output,

Reliable Controls Corporation

MACH-Vision(tm)

New Equipment |  

The Reliable Controls MACH-Vision is an LCD based user controller that gives operators yet another simple, flexible, and economical solution to access, control and monitor their building environments. It is a fully programmable, 5 input by 4 output,

Reliable Controls Corporation

Electronics Forum: backward compatibility (24)

Backward compatibility in LF solder pot

Electronics Forum | Fri Jul 22 07:36:18 EDT 2005 | Guest

It's the same like asking wether you get a gold-contaminated solder pot when soldering ENIG boards. As long as the replenishment of dross is large compared to the intake of contaminant, the contamination level will stay within acceptable levels.

Backward compatibility in LF solder pot

Electronics Forum | Mon Jul 25 17:24:25 EDT 2005 | Kris

0.2% lead will make your solder non compliant with RoHS when you move to a completely RoHS compliant BOM. Check with your bar vendor how much it will take to convert a pot containing 0.2% lead to

Used SMT Equipment: backward compatibility (41)

Agilent 86100D Oscilloscope Mainframe

Agilent 86100D Oscilloscope Mainframe

Used SMT Equipment | General Purpose Test & Measurement

Main features:   • 90 GHz bandwidth• Custom host for optical, electrical and TDR/S parameter analysis• Ultra-low jitter of 100 fs RMS and down to 250 μV ensures fast, accurate and consistent jitter measurements• Access to over 50 built-in standard te

Shenzhen Megatech

Agilent 86100D Infiniium DCA-X Wide-Bandwidth Oscilloscope Mainframe

Agilent 86100D Infiniium DCA-X Wide-Bandwidth Oscilloscope Mainframe

Used SMT Equipment | General Purpose Test & Measurement

100 GHz Customize the mainframe for optical, electrical, and TDR/S-parameter analysis Perform fast, accurate, and compliant jitter measurements with ultra-low jitter of 100 fs RMS and noise as low as 250 µV Get more than 50 built-in standards-base

Shenzhen Zhongce Photoelectric Technology Co., LTD

Industry News: backward compatibility (29)

SMTA INTERNATIONAL 2008 TO FEATURE LEAD-FREE SOLDERING TECHNOLOGY SYMPOSIUM

Industry News | 2008-04-22 20:31:31.0

MINNEAPOLIS, MN � The SMTA is pleased to announce the return of their renowned Lead-Free Symposium, scheduled to run during their annual conference, SMTA International, at Disney�s Coronado Springs Resort and Convention Center in Orlando, Florida, August 17-21. Being held for the 8th consecutive year, some of the industry�s finest Lead-Free research is presented at this symposium.

Surface Mount Technology Association (SMTA)

Agilent Technologies Presents Web Seminar Advanced Validation and Testing of

Industry News | 2008-05-03 17:15:32.0

PCI Express brought about a whole new series of challenges for designers and the next generation. PCI Express 2.0 takes the challenges to a new level. Doubling the speed of the link to 5 GT/s, while maintaining backwards compatibility with PCI Express 1.0 potentially opens up interoperability issues. This presentation describes the methods and tools required to validate PCI Express 2.0 designs.

Agilent Technologies, Inc.

Parts & Supplies: backward compatibility (4)

Sanyo 8mm feeder CT-0882 feeder

Sanyo 8mm feeder CT-0882 feeder

Parts & Supplies | Pick and Place/Feeders

Universal Instuments 4796L / Samyo TCM 3700 Feeders Feeders are backwards compatible. (100) CT-0890 8X2 Paper Yellow (20) CT-0896 8X2 Paper Yellow (20) CT-0895 8X2 Paper (0201) Yellow / Black (30) CT-0891 8X4 Paper Red (26) CT-0898 8X4 Paper Re

Jinchen Electric Technology Co,.Ltd

Sanyo 8mm FEEDER CT-0892

Sanyo 8mm FEEDER CT-0892

Parts & Supplies | Pick and Place/Feeders

Universal Instuments 4796L / Samyo TCM 3700 Feeders Feeders are backwards compatible. (100) CT-0890 8X2 Paper (20) CT-0896 8X2 Paper Yellow (20) CT-0895 8X2 Paper (0201) Yellow / Black (30) CT-0891 8X4 Paper Red (26) CT-0898 8X4 Paper Red (100

Jinchen Electric Technology Co,.Ltd

Technical Library: backward compatibility (4)

The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array

Technical Library | 2012-06-21 23:06:06.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Most high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products despite the increasing trend for design and conversion

Alcatel-Lucent

Microstructure and Intermetallic Formation in SnAgCu BGA Components Attached With SnPb Solder Under Isothermal Aging

Technical Library | 2022-10-31 17:09:04.0

The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.

CALCE Center for Advanced Life Cycle Engineering

Videos: backward compatibility (8)

ALPHA® TETRABOND™

ALPHA® TETRABOND™

Videos

ALPHA® TETRABOND™ is the culmination of "frameless" stencil development; an elegantly simple system designed to enhance the rigidity of the foil, making safe mounting and demounting an easier proposition. Innovatively encompassed in a thin, one piece

MacDermid Alpha Electronics Solutions

Speedprint SP710 SMT stencil printer with the ADu+ option can now put down glue and paste lines

Speedprint SP710 SMT stencil printer with the ADu+ option can now put down glue and paste lines

Videos

Speedprint SP710 SMT stencil printer with the ADu+ option can now put down glue and paste lines

Speedprint Technology

Career Center - Resumes: backward compatibility (1)

BankeemChheda-Resume

Career Center | Rochester, New York USA | Engineering

I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research

Express Newsletter: backward compatibility (91)

The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array

The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array SMTnet Express June 22, 2012, Subscribers: 25283, Members: Companies: 8903, Users: 33267

SMTnet Express - November 19, 2015

SMTnet Express, November 19, 2015, Subscribers: 23,763, Members: Companies: 14,760, Users: 39,366 HALT Testing of Backward Soldered BGAs on a Military Product B. Gumpert, B. Fox, L. Woody; Lockheed Martin Corporation The move to lead free (Pb

Partner Websites: backward compatibility (42)


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