New SMT Equipment: backward solder (15)

Hot selling optical motherboard BGA chip rework station for laptop/mobile PCBA chip soldering and desoldering

Hot selling optical motherboard BGA chip rework station for laptop/mobile PCBA chip soldering and desoldering

New Equipment | Rework & Repair Equipment

Hot selling optical motherboard BGA chip rework station for laptop/mobile PCBA chip soldering and desoldering Features: 1.Hot air heater head and mounting head are designed 2 in 1, driven by step electric motor, have both the auto soldering a

Shenzhen Honreal Technology Co.,Ltd

Shultte Star SV-560A Automatic bga rework machine soldering desoldering station bga rework station printed circuit board repair

Shultte Star SV-560A Automatic bga rework machine soldering desoldering station bga rework station printed circuit board repair

New Equipment | Rework & Repair Equipment

Shutte Star SV-560A Automatic bga rework machine soldering desoldering station bga rework station printed circuit board repair Features: 1. Hot air heater head and mounting head are designed 2 in 1, with auto pick-up,auto solder,auto desolder a

Shenzhen Honreal Technology Co.,Ltd

Electronics Forum: backward solder (57)

Backward compatibility in LF solder pot

Electronics Forum | Fri Jul 22 07:36:18 EDT 2005 | Guest

It's the same like asking wether you get a gold-contaminated solder pot when soldering ENIG boards. As long as the replenishment of dross is large compared to the intake of contaminant, the contamination level will stay within acceptable levels.

Backward compatibility in LF solder pot

Electronics Forum | Mon Jul 25 17:24:25 EDT 2005 | Kris

0.2% lead will make your solder non compliant with RoHS when you move to a completely RoHS compliant BOM. Check with your bar vendor how much it will take to convert a pot containing 0.2% lead to

Industry News: backward solder (15)

Frost & Sullivan Award Highlights Heller Industries' Achievements in Global SMT Reflow Soldering Equipment Market

Industry News | 2013-05-21 22:12:09.0

Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.

Heller Industries Inc.

SMTA INTERNATIONAL 2008 TO FEATURE LEAD-FREE SOLDERING TECHNOLOGY SYMPOSIUM

Industry News | 2008-04-22 20:31:31.0

MINNEAPOLIS, MN � The SMTA is pleased to announce the return of their renowned Lead-Free Symposium, scheduled to run during their annual conference, SMTA International, at Disney�s Coronado Springs Resort and Convention Center in Orlando, Florida, August 17-21. Being held for the 8th consecutive year, some of the industry�s finest Lead-Free research is presented at this symposium.

Surface Mount Technology Association (SMTA)

Technical Library: backward solder (3)

HALT Testing of Backward Soldered BGAs on a Military Product

Technical Library | 2015-11-19 18:15:07.0

The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.

Lockheed Martin Corporation

The Effect of Pb Mixing Levels on Solder Joint Reliability and Failure Mode of Backward Compatible, High Density Ball Grid Array Assemblies

Technical Library | 2015-01-08 17:26:59.0

Regardless of the accelerating trend for design and conversion to Pb-free manufacturing, many high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products. Certain high reliability electronic products from the telecommunication, military, and medical sectors manufacture using SnPb solder assembly and remain in compliance with the RoHS Directive (restriction on certain hazardous substances) by invoking the European Union Pb-in-solder exemption. Sustaining SnPb manufacturing has become more challenging because the global component supply chain is converting rapidly to Pb-free offerings and has a decreasing motivation to continue producing SnPb product for the low-volume, high reliability end users. Availability of critical, larger SnPb BGA components is a growing concern

Sanmina-SCI

Videos: backward solder (5)

ALPHA® TETRABOND™

ALPHA® TETRABOND™

Videos

ALPHA® TETRABOND™ is the culmination of "frameless" stencil development; an elegantly simple system designed to enhance the rigidity of the foil, making safe mounting and demounting an easier proposition. Innovatively encompassed in a thin, one piece

MacDermid Alpha Electronics Solutions

SparkFun LEADSMT Stencil Printer

SparkFun LEADSMT Stencil Printer

Videos

A sneak peek at SparkFun's new LEADSMT Stencil Printer Tags: Business Talent: Robert Hunke

ShenZhen Leadsmt Technology Co.,Ltd

Career Center - Resumes: backward solder (2)

BankeemChheda-Resume

Career Center | Rochester, New York USA | Engineering

I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research

SMT PRODUCTION ENGINEER

Career Center | Muzzaffarnagar, India | Production

Complete programming of Pick & Place as per BOM. Working with both low & high Profile solder Paste, and Glue. Accurate Placement of all SMT Component like Chip, SOT, SOD, QFP, Tantalum Capacitor & etc. Familiar with the critical problem in process

Express Newsletter: backward solder (977)

The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array

The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array SMTnet Express June 22, 2012, Subscribers: 25283, Members: Companies: 8903, Users: 33267

SMTnet Express - November 19, 2015

SMTnet Express, November 19, 2015, Subscribers: 23,763, Members: Companies: 14,760, Users: 39,366 HALT Testing of Backward Soldered BGAs on a Military Product B. Gumpert, B. Fox, L. Woody; Lockheed Martin Corporation The move to lead free (Pb

Partner Websites: backward solder (45)

RW-560A BGA Rewor Station_Shenzhen Honreal Technology CO.,Ltd.

| http://www.szhonreal.com/productview.asp?id=41

. Hot air heater head and mounting head are designed 2 in 1, with auto pick-up,auto solder,auto desolder and auto placement function

2012.18 Released! - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/2012-18-released_topic531_post1653.html

! Fixes & Updates: Fiducial preferences rotations now functions as expected CADSTAR Top & Bottom preferences now save as expected, and top layer definition no longer applied to solder mask Changed resouce definition to 'Wire Rectangular

PCB Libraries, Inc.


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