Electronics Forum | Fri Jul 22 07:36:18 EDT 2005 | Guest
It's the same like asking wether you get a gold-contaminated solder pot when soldering ENIG boards. As long as the replenishment of dross is large compared to the intake of contaminant, the contamination level will stay within acceptable levels.
Electronics Forum | Mon Jul 25 17:24:25 EDT 2005 | Kris
0.2% lead will make your solder non compliant with RoHS when you move to a completely RoHS compliant BOM. Check with your bar vendor how much it will take to convert a pot containing 0.2% lead to
Electronics Forum | Fri Jul 22 03:07:45 EDT 2005 | Joseph
Dear all, As we know there is a high risk of reliability issue due to lead contamination during mixture of NLF component at LF wave soldering process. But we have the following feed back from one of our customer as follow: Concerning the risk of m
Electronics Forum | Tue Aug 14 17:09:37 EDT 2001 | davef
Dano's confused. The boards are delaminating during soldering. The delamination just isn't immediately appartent after soldering. Stepping backwards. It's remotely possible that if the boards were blistering hot from soldering and then dumped in
Electronics Forum | Wed Nov 08 19:49:41 EST 2006 | davef
Dr. Brian Toleno wrote that section of the posting that I pasted onto the forum. Try: * �Lead-free Soldering Backward Compatibility�, Pan, et al., IPC/JEDEC Pb-free Conference, San Jose, 2006 * Checking with http://www.ipc.org * Contacting Jianbia
Electronics Forum | Wed Jul 25 13:29:24 EDT 2007 | realchunks
Hi Lloyd, Homeplates will get rid of solder balling. They are only recommended "backwards" for 0402 or smaller (Points point away from each other). If you do this, you will have a full pad width of paste on the pad for the part to stick in. Obvio
Electronics Forum | Wed May 24 19:46:32 EDT 2006 | JohnM
So, it looks like the backward compatible of BGA statement is not guarantee for solder joint reliability. It doesn�t matter what temperature and what melting sequence we have in order to avoid the solder void issue. Is Pb diffused homogeneously thr
Electronics Forum | Tue Sep 16 16:30:49 EDT 2008 | ck_the_flip
Vlad, yes, he made no mention of a BGA, but I thought I'd just throw it in there. Many people are concerned with the "backward compatible" scenario - running RoHS parts with a Sn/Pb solder paste. The scenario's a no-brainer with most components, bu
Electronics Forum | Mon Jul 16 10:51:09 EDT 2007 | patrickbruneel
D. Hillman, et al., �The Impact of Reflowing a Pb free Solder Alloy Using a Tin/Lead Solder Alloy Reflow Profile on Solder Joint Integrity,� International Conference on Lead-free Soldering, CMAP, Toronto, Ontario, Canada, May 24-26, 2005, http://www.
Electronics Forum | Fri Dec 16 19:48:16 EST 2005 | Ola
Mika has a point here. AMD has some RoHS compliant components that are Not backwards compatible, in terms of leaded soldering paste & reflow temperature! They are Not willing to tell You Why! I think it has to do with something like: http://www.webel
