Electronics Forum: baking (Page 1 of 128)

component baking

Electronics Forum | Wed Aug 21 07:24:12 EDT 2002 | bayanbaru

What is the correct method to bake or cure the component?Standard baking practise by us is to place the units into oven at 125 �C for 8 hrs directly. But I was told that the correct baking practise is to cool down the Baking Oven to Room temp and onl

BGA baking

Electronics Forum | Wed Mar 23 10:16:47 EDT 2011 | blnorman

If these are moisture sensitive they are required to be shipped in a moisture barrier bag and labeled as moisture sensitive. Depending on which moisture sensitivity level (MSL) the components have, floor life can range from unlimited to a mandatory

component baking

Electronics Forum | Fri Aug 16 11:13:17 EDT 2002 | kenbliss

I have a question for everyone about component baking. In my view this is rework. The component was manufactured and shipped correctly and should not need baking in order to use it. Some how in storing the component in a stockroom atmosphere (I as

component baking

Electronics Forum | Fri Aug 16 17:08:07 EDT 2002 | davef

Could be. It does indicate imperfection. * �The component was manufactured and shipped correctly and should not need baking in order to use it.� => Sounds good. Most classes of MSD packaging have a self-life. Lots of times it�s expired before it

BGA baking

Electronics Forum | Sun Mar 20 14:47:29 EDT 2011 | floydf

We are going to be placing BGAs for the first time, and I have some questions. Is it recommended top bake all of the boards and all of the BGAs before production? I have had good luck baking boards that didn't wave solder well. It usually turns out

component baking

Electronics Forum | Sat Aug 17 08:59:11 EDT 2002 | davef

Clarifying: 1. About 2% of part numbers have a moisture problem

component baking

Electronics Forum | Thu Sep 12 12:31:22 EDT 2002 | slthomas

"In theory there is no difference between theory and practice, in practice there is." That's beautiful...is it yours?

component baking

Electronics Forum | Tue Sep 03 18:14:35 EDT 2002 | fmonette

I have never heard about a requirement for temperature ramp-up for baking components at 125C. In general the concern for delamination with moisture sensitive components starts above 200C (peak body temp). Most important is you should bake your com

component baking

Electronics Forum | Thu Sep 12 14:48:15 EDT 2002 | stepheno

I found the article online that I was talking about. It was in Cirucuits Assembly. http://www.circuitsassembly.com/mag/0205/0205cmac.html I found the artcile quite interesting

component baking

Electronics Forum | Fri Aug 16 18:23:48 EDT 2002 | kenbliss

Hi Dave Interesting points. If I understand you correctly 1. about 2% of part numbers have a moisture problem 2. Packaging frequently comes in with expired dates on them. This seems hard to believe you would accept them. 3. To really solve the

  1 2 3 4 5 6 7 8 9 10 Next

baking searches for Companies, Equipment, Machines, Suppliers & Information

Selective soldering solutions with Jade soldering machine

High Precision Fluid Dispensers
Selective Soldering Nozzles

High Throughput Reflow Oven
Software for SMT

World's Best Reflow Oven Customizable for Unique Applications
Electronics Equipment Consignment

High Resolution Fast Speed Industrial Cameras.


Training online, at your facility, or at one of our worldwide training centers"