Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2003-04-21 09:11:21.0
One for SMT Processes and one for SMT Systems
Industry News | 2003-02-22 13:30:35.0
Trains all levels of program managers within the EMS industry in operations, project management, finance, contract management and leadership skills.
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Industry News | 2023-11-13 12:31:47.0
Circuit Technology Center announces it has added the capability to trim and form electronic component packages to customers' exact pre-assembly specifications. They can also propose a trim and lead-form drawing if needed. Dedicated, custom tooling can be fabricated to meet custom package requirements.
Industry News | 2011-02-26 16:00:45.0
Essemtec AG announces that its Tower Automatic Storage System simplifies logistics and increases the flexibility of production for Variosystems, an international electronics manufacturing subcontractor
Industry News | 2003-04-03 08:37:55.0
Leading Global EMS Company Exchanges Its Current Design-to-Assembly Workflow With the Trilogy 5000 Technology Backbone for Manufacturing
Industry News | 2019-05-16 01:24:13.0
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development trend. The application of the resin plugging process has also become more and more extensive, and it has been used in HDI panels.
Industry News | 2011-11-08 14:14:14.0
Michelle Ogihara, Senior Sales Manager with Seika Machinery, Inc. will attend the Seika Sangyo GmbH Booth 317 in Hall A2 at the upcoming Productronica International Trade Fair
Industry News | 2011-02-14 14:41:46.0
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will debut new products and features from McDry in Booth #459 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
