Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis
Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in
Electronics Forum | Fri May 31 10:35:46 EDT 2002 | dason_c
I think that the IPC spec only apply to the MSD. I had a paper from Lucent and forwarded by Francois Monette, please aware that the first 2 hours, the moisture doesn't bake out from the assembly/component and result show that it is increase the weigh
Electronics Forum | Mon May 27 12:24:21 EDT 2002 | arcandspark
Carol, I beleive there is an IPC spec for Moisture control. We see all kinds of problems with boards coming from the vendors. We use to bake all bare fabs upon recieving them. This helped alot but waste time. We now rely on the board vendors to bake
Electronics Forum | Mon May 27 18:25:03 EDT 2002 | Carol Stirling
Thanks for the information Reworkman, We are leaning to the theory of better safe than sorry. I think I'd supply the bags and dessicant just to eliminate manufacturing issues. What temps & times do you ask your boardhouse to bake to? Ours said some
Electronics Forum | Wed May 08 11:07:54 EDT 2002 | Carol Stirling
We have a concern with moisture absorbtion/humidity effects on PWBs specifically used for automated SMT (including BGA). I'm sure there is a IPC spec on this and would appreciate the number - I've searched the IPC web-site -no results. Could you t
Electronics Forum | Tue May 28 22:06:09 EDT 2002 | arcandspark
Two hours at 125 C will do nothing. IPC's new spec is 48 hours at 125C, the old spec I use to use for years was 24 hours at 125C. I do not have all the spec in front of me but if you reduce the temp to around 60C it can take up to 48 days. We use to
Electronics Forum | Tue May 28 22:06:18 EDT 2002 | arcandspark
Two hours at 125 C will do nothing. IPC's new spec is 48 hours at 125C, the old spec I use to use for years was 24 hours at 125C. I do not have all the spec in front of me but if you reduce the temp to around 60C it can take up to 48 days. We use to
Electronics Forum | Mon May 21 11:14:06 EDT 2012 | joeherz
Polymide is like a sponge and absorbs moisture much faster than rigid substrates. Pre-bake your substrate for 2-4 hours at 125C and perform your soldering within 1 shift thereafter or seal in moisture barrier bags.
Electronics Forum | Mon Dec 20 19:09:54 EST 1999 | Chris
If your flex circuit is only populated on one side, you can have the PCB vendor palletize the flex for you. What you do is have the flex circuit laminated to 062" FR4 using a thermoset adhesive like Dupont WA. Standard flex circuit adhesive. Howev
Electronics Forum | Fri May 18 23:48:02 EDT 2012 | mspcb
Hi, Since you're looking information about flexible printed circuits,a book entitled "Printed Circuit Boards R. S. Khandpur" could give you lot of information about flex circuits from Design, Fabrication, and Assembly Phase. The book contains compr
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