New SMT Equipment: baking fr4 (2)

PCB cutting tool

PCB cutting tool

New Equipment | Depaneling

PCB cutting tool is placed on the adapted platform and moves along the guide blade. The lower round blade actively rotates and the upper round knife is rotates passively. Shear stress is reduced to the minimum, suitable for long strip aluminum substr

ASCEN Technology

Electronics Forum: baking fr4 (55)

Bare PCB baking

Electronics Forum | Tue Nov 19 02:59:24 EST 2002 | yngwie

Hi Experts out there, pls help me with the following matters. How important is the bare PCB baking ? What is the temperature for baking @ what RH ? What would be the impact for the ENTEK finished board should the baking is really necessary ? For t

Bare PCB baking

Electronics Forum | Wed Nov 20 16:53:18 EST 2002 | davef

Q1: How important is the bare PCB baking ? A1: Baking boards is a non-value added activity. Q2: What is the temperature for baking @ what RH ? A2: Search the fine SMTnet Arcives for bake recipes. Q3: What would be the impact for the ENTEK finishe

Industry News: baking fr4 (1)

Typical RoHS Issues in PCB Assembly

Industry News | 2018-10-18 10:23:07.0

Typical RoHS Issues in PCB Assembly

Flason Electronic Co.,limited

Technical Library: baking fr4 (27)

Non-Destructive Test Methods

Technical Library | 2019-09-23 09:35:00.0

Failure analysis (FA), by its very nature, is needed only when things goawry. Before any testing is performed on the sample, a decision mustbe made as to whether or not the sample is allowed to be destroyedin the process of testing. Non-destructive testing can allow for re-use of the assembly since the functionality is not altered, but there still remains the possibility that inadvertent damage can occur through the course of the analysis. If non-destructive testing is preferred, then the following types of analysis can be performed. The testing can be divided into four categories: visual, X-ray (X-ray imaging and X-ray fluorescence), cleanliness (resistivity of solvent extract, ion chromatography, and Fourier transform infrared spectroscopy), and mechanical (non-destructive wire bond pull).

ACI Technologies, Inc.

Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment

Technical Library | 2012-09-20 21:45:38.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturin

Agilent Technologies, Inc.

Videos: baking fr4 (2)

ASCEN Technology

PCB cutting tool

Videos

PCB cutting machine

PCB cutting separator

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PCB cutting machine,PCB separator,PCB depaneling machine,PCB cutting tool,PCB cutting machine,PCB cutting separator

Videos

PCB separator is placed on the adapted platform and moves along the guide blade. The lower round blade actively rotates and the upper round knife is rotates passively. Shear stress is reduced to the minimum, suitable for long strip aluminum substrate

ASCEN Technology

Express Newsletter: baking fr4 (48)


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