New SMT Equipment: bare baking (1)

Surface Mount Device Tape and Reel Service

Surface Mount Device Tape and Reel Service

New Equipment | Tape and Reel Services

Syagrus Systems specializes in high mix low volume surface mount device (SMD) tape and reel packaging to support component distributors and OEM's. We offer the highest quality SMD tape and reel services available, and at lower costs than most compani

Syagrus Systems

Electronics Forum: bare baking (81)

Bare PCB baking

Electronics Forum | Tue Nov 19 02:59:24 EST 2002 | yngwie

Hi Experts out there, pls help me with the following matters. How important is the bare PCB baking ? What is the temperature for baking @ what RH ? What would be the impact for the ENTEK finished board should the baking is really necessary ? For t

baking PWB standard??

Electronics Forum | Tue Aug 26 03:48:44 EDT 2008 | eyalg

Does anyone know if the IPC 610 standard call for baking bare boards (PWB) prior assembly? Note: I am talking about bare boars only and NOT plastic packages components, Regards. Eyal Green

Used SMT Equipment: bare baking (3)

Vitronics XPM2 REFLOW OVEN

Vitronics XPM2 REFLOW OVEN

Used SMT Equipment | Soldering - Reflow

MULTIPLE VITRONICS REFLOW OVENS AVAILABLE WWW.XLINEASSETS.COM - AUCTION ITEMS JABIL LIQUIDATION Featured Equipment: St. Petersburg, FL Universal Genesis 4988C With FlexJet 3 Heads Universal Genesis 4990B With Lighting Head Air-Vac DRS 18

X-Line Asset Management

Fuji CP 642 and CP65

Fuji CP 642 and CP65

Used SMT Equipment | Pick and Place/Feeders

Multiple Fuji CP Chipshooters Available. www.xlineassets.com   AUCTION ITEMS Jabil Liquidation Including Universal Genesis 4988C With FlexJet 3 Heads Universal Genesis 4990B With Lighting Head Air-Vac DRS 18 Rework System Flexlink Transfer C

X-Line Asset Management

Industry News: bare baking (5)

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

SMART Group to Host Moisture-Sensitive Components/PCB Handling Workshop

Industry News | 2011-12-30 23:20:54.0

SMART Group, Europe’s largest technical trade association focusing on surface mount and related technologies, announces that it will host a workshop titled Handling Moisture-Sensitive Components & PCBs Without Failure on Wednesday, January 25, 2012 at the Stoke Mandeville Stadium in Aylesbury, Buckinghamshire, UK.

The SMART Group

Technical Library: bare baking (27)

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Technical Library | 2021-01-03 19:24:52.0

Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.

SMTnet

Non-Destructive Test Methods

Technical Library | 2019-09-23 09:35:00.0

Failure analysis (FA), by its very nature, is needed only when things goawry. Before any testing is performed on the sample, a decision mustbe made as to whether or not the sample is allowed to be destroyedin the process of testing. Non-destructive testing can allow for re-use of the assembly since the functionality is not altered, but there still remains the possibility that inadvertent damage can occur through the course of the analysis. If non-destructive testing is preferred, then the following types of analysis can be performed. The testing can be divided into four categories: visual, X-ray (X-ray imaging and X-ray fluorescence), cleanliness (resistivity of solvent extract, ion chromatography, and Fourier transform infrared spectroscopy), and mechanical (non-destructive wire bond pull).

ACI Technologies, Inc.

Express Newsletter: bare baking (91)


bare baking searches for Companies, Equipment, Machines, Suppliers & Information

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Fluid Dispense Pump Integration

Software for SMT placement & AOI - Free Download.


Repair tools for all your electronic circuit board repair needs.
ACI Technologies, Inc - One Day Training

Heller - Best value SMT Reflow Ovens in the market.