New Equipment | Cable & Wire Harness Equipment
An excellent solution for customers looking for a simple, low-cost crimping press. The UniCrimp 100 can deliver up to 2.2 tons (20 kN) of crimping force for applications up to 6 mm2 (10AWG). Simple design that is very easy to use. Extremely cost
New Equipment | Rework & Repair Equipment
Eyelets are made from copper and are tin electronplated unless specified. Chose the proper eyelet keeping the following in mind: LUF The length of the eyelet barrel under the flange should be 0.020-0.035”/0.630-0.890mm greater than the thickness of
Electronics Forum | Sat Dec 10 07:03:59 EST 2005 | mdemos1
Hi. I am trying to find out the minimum copper thickness I should see on a through hole barrel. The board has 1 ounce copper and the board thickness is 0.062". I am finding thicknesses of 0.6 to 1.2 mils. Thanks, Mike.
Electronics Forum | Fri Jan 07 09:03:44 EST 2022 | jineshjpr
Hi Everyone, I want to understand what is the copper thickness to be maintained in PTH Barrel hole. Is this same as Fab recommendation of surface finished copper thickness like 25/35/70 microns..??? Is there any specific IPC standards available to un
Industry News | 2010-12-17 01:47:04.0
IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.
Industry News | 2009-12-07 19:48:02.0
Techcon Systems invites visitors to Productronica 2009 to ‘TAP’ into Techcon Systems ‘Training’, ‘Application’ and ‘Productivity’ advantages with an impressive line up of the latest cost-saving fluid dispensing solutions. A leading global supplier of fluid dispensing systems and accessories, Techcon Systems will exhibit alongside Metcal and Oki branded products on the OK International Stand 127, Hall A4 at the bi-annual event, which is scheduled to take place 10th – 13th November at the New Munich Trade Fair Center in Munich, Germany. German companies will also be able to discuss Techcon Systems products at the show with German partner Globaco.
Parts & Supplies | SMT Equipment
ADBHF8060 QP351E-OF SAM6580 SERVO MOTOR SGMAH-A 5A 1A 4C (AC, 50W, Multi Phase) MTU9E (TY) SAM6590 SERVO MOTOR SGMAH-04A 1A 4C (AC, 400W, Multi Phase) MTU9E (TZ) SAM6600 SERVO MOTOR SGMM-A 1C 3FJ14 (AC, 10W, Multi Phase) QP341E/NP1 (Q) POWER SU
Technical Library | 2021-07-20 20:02:29.0
During the manufacturing of printed circuit boards (PCBs) for a Flight Project, it was found that a European manufacturer was building its boards to a European standard that had no requirement for copper wrap on the vias. The amount of copper wrap that was measured on coupons from the panel containing the boards of interest was less than the amount specified in IPC-6012 Rev B, Class 3. To help determine the reliability and usability of the boards, three sets of tests and a simulation were run. The test results, along with results of simulation and destructive physical analysis, are presented in this paper. The first experiment involved subjecting coupons from the panels supplied by the European manufacturer to thermal cycling. After 17 000 cycles, the test was stopped with no failures. A second set of accelerated tests involved comparing the thermal fatigue life of test samples made from FR4 and polyimide with varying amounts of copper wrap. Again, the testing did not reveal any failures. The third test involved using interconnect stress test coupons with through-hole vias and blind vias that were subjected to elevated temperatures to accelerate fatigue failures. While there were failures, as expected, the failures were at barrel cracks. In addition to the experiments, this paper also discusses the results of finite-element analysis using simulation software that was used to model plated-through holes under thermal stress using a steady-state analysis, also showing the main failure mode was barrel cracking. The tests show that although copper wrap was sought as a better alternative to butt joints between barrel plating and copper foil layers, manufacturability remains challenging and attempts to meet the requirements often result in features that reduce the reliability of the boards. Experimental and simulation work discussed in this paper indicate that the standard requirements for copper wrap are not contributing to the overall board reliability, although it should be added that a design with a butt joint is going to be a higher risk than a reduced copper wrap design. The study further shows that procurement requirements for wrap plating thickness from Class 3 to Class 2 would pose little risk to reliability (minimum 5 μm/0.197 mil for all via types).Experimental results corroborated by modeling indicate that the stress maxima are internal to the barrels rather than at the wrap location. In fact, the existence of Cu wrap was determined to have no appreciable effect on reliability.
Teaching video on PCB through hole repair. BEST instructors teach the method for repair of a damaged eyelet using a multitude of different close up and angled views. Repair is completed per the IPC 7721 instructions. http://www.solder.net
Quick Overview Lead Free Best Solution M400 is a CE certificated compact Lead Free Wave Solder Machine with inline finger conveyor, stepper driven spraying fluxer, hot air preheat zone & Ti dua wave solder pot. M400 Lead Free Wave Solder Machine
SMTnet Express, December 23, 2015, Subscribers: 23,927, Members: Companies: 14,845, Users: 39,621 PCB Fabrication Processes and Their Effects on Fine Copper Barrel Cracks Edward Arthur, Charles Busa, Melissa Durfee, Chad Gibson, Wade Goldman P
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_component-leads-too-short_topic1789.xml
5- Lead diameter: 1mm (in most of the cases) , hole diameter : 1.3 mm 6- In most of the cases the barrel of the hole is tied to power internal planes. 
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
experienced some degree of Cu dissolution. Depending on the size and complexity of the connector and PCB itself, the extent of dissolution would have ranged from either a slight loss of the barrel knee and annular ring edges to a complete loss of the pad