Industry Directory | Manufacturer
Manufacturer of Real-time Automated Xray Inspection. Focus on SMT solder joint inspection of hidden joints ie, BGAs and PTH Barrel Fill per IPC-610. Clients include leading manufacturers in the electronics/automotive Industries.
New Equipment | Cleaning Equipment
QYSMT MOREL Electirc fixture cleaning machine SMS-5200 SMS-5200 electric fixture cleaning machine is mainly used for flux cleaning on the surface of wave soldering fixtures, and can also be used to clean reflow soldering trays, filters, wave solde
New Equipment | Education/Training
IPC A-600H Acceptability of Electronic Assemblies. The IPC-A-600, "Acceptability of Printed Boards " is the most widely used published specification on printed wiring boards. This specification has set the standard for rigid printed boards in terms o
Electronics Forum | Wed Dec 10 00:15:07 EST 2008 | jeffjarmato
Are there any good solutions for getting good barrel fill on PTH boards using Pb Free solder and No Clean flux. All of our boards are having issues getting minimum required fill per IPC. It does not matter if the board is 062 or thicker, any pin conn
Electronics Forum | Wed Dec 19 09:41:14 EST 2012 | dyoungquist
What is your solder pot temperature? We found that on a 0.093" multilayer board increasing the temp of the lead free solder from 300C to 315C helped with the barrel fill.
Industry News | 2018-03-13 18:51:40.0
SMTA is excited to announce the technical program has been finalized and registration is now open for the South East Asia Technical Conference on Electronics Assembly. The event will be held May 8-10, 2018 at the MITEC in Kuala Lumpur, Malaysia.
Industry News | 2010-12-17 21:02:56.0
The SMTA is pleased to announce the Best Papers from SMTA International 2010. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.
Technical Library | 2019-06-21 10:39:15.0
Recently, an ACI Technologies (ACI) customer called to discuss failures that they had observed with some through-hole capacitor parts. The components were experiencing failures following vibration and accelerated stress testing. Upon receipt of the samples, ACI performed three levels of inspection and Energy Dispersive Spectroscopy (EDS) testing to investigate the root cause of the failures. These analyses enabled ACI to verify the elements comprising the solder joints and make the following recommendations in order to prevent future occurrences. The first inspection was to investigate the capacitor leads using optical microscopy, and no anomalies were found that could indicate bad parts from the vendor or improper handling prior to assembly. However, vertical fill in the barrel of the plated through-holes was too close to the IPC-A-610 minimum specification of 75% to determine a pass/fail condition, and therefore required further investigation.
Technical Library | 2015-02-27 17:06:01.0
The drive towards fine pitch technology also affects the soldering processes. Selective soldering is a reliable soldering process for THT (through hole) connectors and offers a wide process window for designers. THT connectors can be soldered on the top and bottom side of boards, board in board, PCBs to metal shields or housing out of plastic or aluminum are today's state of the art. The materials that are used to make the solder connections require higher temperatures. Due to the introduction of lead-free alloys, the boards need more heat to get the barrels filled with solder. This not only affects the properties of the flux and components, but the operation temperatures of solder machines become higher (...)First the impact of temperature will be discussed for the separate process steps and for machine tooling. In the experimental part measurements are done to verify the accuracy that can be achieved using today's selective soldering machines. Dedicated tooling is designed to achieve special requirements with respect to component position accuracy.
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
The X2 is an advanced In-line X-RAY inspection system designed for high-speed automatic inspection in production lines. Transmission X-RAY technology is combined with patented Slice-Filter-Technology (SFT) for double-sided PCB assembly and component
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.